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tdoc Title Type / Revs Source Spec / CR S/WID Release Meeting Status Links
C1-233283 Inclusion of Extended LADN information IE in REGISTRATION ACCEPT message CR

revision of C1-232958

revised to C1-234047

Huawei, HiSilicon, Apple, SIA 24.501 18.2.1 CR#52142 catB GMEC Rel-18 C1-142

AI: 18.2.34

revised [WTS] [JSN]

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