Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".
Download results in JSON format
| tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
|---|---|---|---|---|---|---|---|---|---|
| S6-180552 | Architecture functional model to support multiple API providers |
CR revised to S6-180623 |
SAMSUNG | 23.222 15.1.0 CR#12 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180567 | Service API publish and discovery requirements for 3rd party API providers |
CR revised to S6-180619 |
Huawei, Hisilicon | 23.222 15.1.0 CR#15 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180568 | Charging requirements for 3rd party API providers |
CR revised to S6-180620 |
Huawei, Hisilicon | 23.222 15.1.0 CR#16 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180569 | OAM requirements for 3rd party API providers |
CR revised to S6-180621 |
Huawei, Hisilicon | 23.222 15.1.0 CR#17 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180570 | CAPIF interconnection requirements |
CR revised to S6-180622 |
Huawei, Hisilicon | 23.222 15.1.0 CR#18 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180619 | Service API publish and discovery requirements for 3rd party API providers |
CR revision of S6-180567 |
Huawei, Hisilicon | 23.222 15.1.0 CR#151 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
agreed | [WTS] [JSN] |
| S6-180620 | Charging requirements for 3rd party API providers |
CR revision of S6-180568 |
Huawei, Hisilicon | 23.222 15.1.0 CR#161 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
agreed | [WTS] [JSN] |
| S6-180621 | OAM requirements for 3rd party API providers |
CR revision of S6-180569 |
Huawei, Hisilicon | 23.222 15.1.0 CR#171 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
agreed | [WTS] [JSN] |
| S6-180622 | CAPIF interconnection requirements |
CR revision of S6-180570 revised to S6-180707 |
Huawei, Hisilicon | 23.222 15.1.0 CR#181 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180623 | Architecture functional model to support multiple API providers |
CR revision of S6-180552 revised to S6-180684 |
SAMSUNG | 23.222 15.1.0 CR#121 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
revised | [WTS] [JSN] |
| S6-180684 | Architecture functional model to support multiple API providers |
CR revision of S6-180623 |
SAMSUNG | 23.222 15.1.0 CR#122 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
agreed | [WTS] [JSN] |
| S6-180707 | CAPIF interconnection requirements |
CR revision of S6-180622 |
Huawei, Hisilicon | 23.222 15.1.0 CR#182 catB | eCAPIF | Rel-16 |
S6-23 AI: 9.1 |
agreed | [WTS] [JSN] |
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