Please enter the search related information in the fields below. Partial information works, e.g. "SP-21
" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501
" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP
" gives the same results as "3gpp
".
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tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
---|---|---|---|---|---|---|---|---|---|
S2-2100038 | LS on MA PDU session for LADN |
LS in source LS: C1-207595 LS To: SA WG2 LS reply in S2-2101574 |
CT WG1 | Rel-16 |
S2-143-e AI: 7.3 |
replied to | [WTS] [JSN] | ||
S2-2100102 | [DRAFT] LS on MA PDU session for LADN |
LS out LS To: CT WG1 |
Nokia, Nokia Shanghai Bell | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
merged | [WTS] [JSN] | |
S2-2100112 | Clarification on LADN support for an MA PDU Session |
CR revised to S2-2101056 |
LG Electronics, Nokia, Nokia Shanghai Bell, Ericsson, Deutsche Telekom | 23.501 16.7.0 CR#2531 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
revised | [WTS] [JSN] |
S2-2100371 | Descriptions for LADN support with MA PDU Session | CR | Samsung | 23.501 16.7.0 CR#2565 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2100372 | Procedures for LADN support with MA PDU Session | CR | Samsung | 23.502 16.7.1 CR#2498 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2100373 | Discussion on LADN support with MA PDU Session . | discussion | Samsung | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] | |
S2-2100374 | [DRAFT] Reply to LS on MA PDU session for LADN |
LS out LS To: CT WG1 |
Samsung Electronics Romania | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] | |
S2-2100491 | [DRAFT] Reply LS on MA PDU session for LADN |
LS out LS To: CT WG1 |
Huawei, Hisilicon | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] | |
S2-2100492 | Clarification on MA PDU session for LADN | CR | Huawei, Hisilicon | 23.501 16.7.0 CR#2588 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
merged | [WTS] [JSN] |
S2-2100493 | Clarification on MA PDU session for LADN |
CR revised to S2-2101575 |
Huawei, Hisilicon | 23.502 16.7.1 CR#2515 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
revised | [WTS] [JSN] |
S2-2100786 | [DRAFT] LS Response on MA PDU session for LADN |
LS out LS To: CT WG1 revised to S2-2101574 |
ZTE | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
revised | [WTS] [JSN] | |
S2-2100787 | MA PDU Session for LADN DNN | CR | ZTE | 23.501 16.7.0 CR#2645 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2100890 | [DRAFT] Reply LS on MA PDU session for LADN |
LS out LS To: CT WG1 |
Qualcomm Incorporated | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] | |
S2-2100891 | MA PDU sessions for LADN. | discussion | Qualcomm Incorporated | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] | |
S2-2100892 | MA PDU Sessions for LADN | CR | Qualcomm Incorporated | 23.501 16.7.0 CR#2660 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2100893 | MA PDU Sessions for LADN | CR | Qualcomm Incorporated | 23.502 16.7.1 CR#2578 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2100894 | MA PDU Sessions for LADN | CR | Qualcomm Incorporated | 23.501 16.7.0 CR#2661 catF | ATSSS | Rel-17 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2100895 | MA PDU Sessions for LADN | CR | Qualcomm Incorporated | 23.502 16.7.1 CR#2579 catF | ATSSS | Rel-17 |
S2-143-e AI: 7.3 |
noted | [WTS] [JSN] |
S2-2101056 | Clarification on LADN support for an MA PDU Session |
CR revision of S2-2100112 |
LG Electronics, Nokia, Nokia Shanghai Bell, Ericsson, Deutsche Telekom, ZTE, Qualcomm Incorporated, Samsung | 23.501 16.7.0 CR#25311 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
agreed | [WTS] [JSN] |
S2-2101574 | LS Response on MA PDU session for LADN |
LS out LS is reply to S2-2100038 LS To: CT WG1 revision of S2-2100786 |
SA WG2 | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
approved | [WTS] [JSN] | |
S2-2101575 | Clarification on MA PDU session for LADN |
CR revision of S2-2100493 |
Huawei, HiSilicon, Qualcomm Incorporated, Samsung | 23.502 16.7.1 CR#25151 catF | ATSSS | Rel-16 |
S2-143-e AI: 7.3 |
agreed | [WTS] [JSN] |
21 documents (0.35031294822693 seconds)