Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".
Download results in JSON format
| tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
|---|---|---|---|---|---|---|---|---|---|
| R2-2400065 | Reply LS on power class indication in lower MSD capability (R4-2321997; contact: Huawei) |
LS in LS is reply to R2-2311586 source LS: R4-2321997 LS To: RAN2 |
RAN4 | NR_ENDC_RF_FR1_enh2-Core | Rel-18 |
R2-125 AI: 7.25.1.1 |
noted | [WTS] [JSN] | |
| R2-2400234 | Left issues on lower MSD capability | discussion | OPPO | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
noted | [WTS] [JSN] | |
| R2-2400722 | Further considerations on lower MSD capability | discussion | Huawei, HiSilicon, Ericsson, Xiaomi, ZTE Corporation, Sanechips | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
noted | [WTS] [JSN] | |
| R2-2400723 | Lower MSD capability for EN-DC |
CR revised to R2-2401944 |
Huawei, HiSilicon, Ericsson | 38.331 18.0.0 CR#4542 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
revised | [WTS] [JSN] |
| R2-2400724 | Lower MSD capability for EN-DC |
CR revised to R2-2401945 |
Huawei, HiSilicon, Ericsson | 38.306 18.0.0 CR#1031 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
revised | [WTS] [JSN] |
| R2-2400725 | Lower MSD capability for EN-DC |
CR revised to R2-2401946 |
Huawei, HiSilicon, Ericsson | 36.331 18.0.0 CR#4991 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
revised | [WTS] [JSN] |
| R2-2400726 | Lower MSD capability for EN-DC |
CR revised to R2-2401947 |
Huawei, HiSilicon, Ericsson | 36.306 18.0.0 CR#1878 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
revised | [WTS] [JSN] |
| R2-2401177 | Lower MSD handling | discussion | Nokia, Nokia Shanghai Bell | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
withdrawn | [WTS] [JSN] | |
| R2-2401944 | Lower MSD capability for EN-DC |
CR revision of R2-2400723 |
Huawei, HiSilicon, Ericsson | 38.331 18.0.0 CR#45421 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
merged | [WTS] [JSN] |
| R2-2401945 | Lower MSD capability for EN-DC |
CR revision of R2-2400724 |
Huawei, HiSilicon, Ericsson | 38.306 18.0.0 CR#10311 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
merged | [WTS] [JSN] |
| R2-2401946 | Lower MSD capability for EN-DC |
CR revision of R2-2400725 |
Huawei, HiSilicon, Ericsson, ZTE Corporation, Sanechips | 36.331 18.0.0 CR#49911 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
agreed | [WTS] [JSN] |
| R2-2401947 | Lower MSD capability for EN-DC |
CR revision of R2-2400726 |
Huawei, HiSilicon, Ericsson, ZTE Corporation, Sanechips | 36.306 18.0.0 CR#18781 catB | NR_ENDC_RF_FR1_enh2 | Rel-18 |
R2-125 AI: 7.25.1.1 |
agreed | [WTS] [JSN] |
12 documents (0.35747313499451 seconds)