Please enter the search related information in the fields below. Partial information works, e.g. "SP-21
" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501
" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP
" gives the same results as "3gpp
".
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tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
---|---|---|---|---|---|---|---|---|---|
R1-2000187 | Remaining details of physical layer procedures for sidelink | discussion | Huawei, HiSilicon | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000267 | Remaining issues on physical layer procedure for NR sidelink | discussion | vivo | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
withdrawn | [WTS] [JSN] | ||
R1-2000321 | Remaining issues on physical layer procedure for NR sidelink | discussion | vivo | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000387 | Remaining details of Physical layer procedures for sidelink | discussion | Nokia, Nokia Shanghai Bell | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000401 | Remaining issues on PHY procedures for Rel-16 sidelink | discussion | ZTE, Sanechips |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000424 | Remaining issues in physical layer procedures for sidelink | discussion | Spreadtrum Communications | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000431 | Physical layer procedures for sidelink | discussion | TCL Communication Ltd. |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000492 | Remaining issues of physical layer procedure for NR-V2X | discussion | OPPO | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000524 | Remaining issues on physical layerprocedures for NR V2X | discussion | CATT |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000549 | Remaining issues on physical layer procedures | discussion | Fujitsu | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000562 | Remaining Issues in Physical Layer Procedures for NR V2X | discussion | Fraunhofer HHI, Fraunhofer IIS, Continental Automotive GmbH | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000568 | Remaining details on physical procedures for sidelink | other | Futurewei |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000584 | Physical layer procedures for NR sidelink | discussion | Sony |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000621 | On Physical Layer Procedures for NR Sidelink | discussion | Samsung | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000697 | Remaining Issues on Physical Layer Procedures in NR Sidelink | discussion | ITRI |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000733 | Remaining Issues and Corrections in Sidelink Procedures | discussion | Intel Corporation | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000749 | Remaining issues on physical layer procedures for sidelink |
discussion revised to R1-2002207 |
CMCC |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000766 | Remaining issues on physical layer procedure | discussion | NEC | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000785 | Discussion on physical layer procedure for NR sidelink | discussion | LG Electronics |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000837 | Remaining Issues on Physical Layer Procedures for NR V2X | discussion | InterDigital, Inc. |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000839 | Summary of critical issues for AI 7.2.4.5 Physical layer procedures for sidelink |
discussion revised to R1-2001134 |
LG Electronics Inc. |
R1-ah-37786 AI: 7.2.4.5 |
revised | [WTS] [JSN] | |||
R1-2000853 | Remaining details on physical layer procedures for NR V2X sidelink | discussion | Apple | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000880 | Remaining issues on physical layer procedures for NR sidelink | discussion | Sharp | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000901 | On procedures for 5G V2x communications | discussion | Xiaomi Communications | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000906 | Remaining details of physical layer procedures for sidelink | discussion | AT&T |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2000918 | Remaining issues on sidelink physical layer procedure | discussion | NTT DOCOMO, INC. | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2000966 | Physical layer procedures for sidelink | discussion | Qualcomm Incorporated | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2000993 | Remaining issue on physical layer procedures for sidelink in NR V2X | discussion | Panasonic Corporation | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
R1-2001012 | Physical layer procedures for NR sidelink | discussion | Ericsson |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2001017 | Remaining issues on sidelink physical layer procedure on NR V2X |
discussion revision of R1-1912906 revised to R1-2002473 |
ASUSTeK |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2001045 | On PSFCH of NR Sidelink | discussion | CAICT |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
R1-2001071 | Remaining issues in NR Sidelink Physical Layer Procedures | discussion | Lenovo, Motorola Mobility | NR_SL_enh, NR_SL_enh-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
R1-2001134 | Summary of critical issues for AI 7.2.4.5 Physical layer procedures for sidelink |
discussion revision of R1-2000839 |
LG Electronics Inc. |
R1-ah-37786 AI: 7.2.4.5 |
noted | [WTS] [JSN] | |||
R1-2001140 | Feature lead summary for AI 7.2.4.5 Physical layer procedures for sidelink |
discussion revised to R1-2001338 |
LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
revised | [WTS] [JSN] | |
R1-2001338 | Feature lead summary#2 for AI 7.2.4.5 Physical layer procedures for sidelink |
discussion revision of R1-2001140 |
LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
noted | [WTS] [JSN] | |
R1-2001426 | LS on sidelink HARQ |
LS out LS To: RAN2 |
RAN1, LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-37786 AI: 7.2.4.5 |
approved | [WTS] [JSN] |
36 documents (0.32638311386108 seconds)