Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".
Download results in JSON format
| tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
|---|---|---|---|---|---|---|---|---|---|
| R1-2001555 | Remaining details of physical layer procedures for sidelink | discussion | Huawei, HiSilicon | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
| R1-2001665 | Remaining issues on physical layer procedure for NR sidelink | discussion | vivo |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2001748 | Remaining issues of physical layer procedure for NR-V2X | discussion | OPPO |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2001808 | Remaining details of Physical layer procedures for sidelink | discussion | Nokia, Nokia Shanghai Bell | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
| R1-2001879 | Remaining issues on power reduction rule for NR V2X | discussion | Fujitsu | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2001889 | Discussion on physical layer procedure for NR sidelink | discussion | LG Electronics |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2001892 | Feature lead summary#1 for AI 7.2.4.5 Physical layer procedures for sidelink |
discussion revised to R1-2002759 |
Moderator (LG Electronics) |
R1-ah-34813 AI: 7.2.4.5 |
revised | [WTS] [JSN] | |||
| R1-2001898 | Remaining issues on PHY procedures for Rel-16 sidelink | discussion | ZTE, Sanechips |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2001965 | Physical layer procedures for sidelink | discussion | TCL Communication Ltd. |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2001970 | Discussion on physical layer procedures for NR sidelink | discussion | Lenovo, Motorola Mobility |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2001979 | Remaining Issues in Physical Layer Procedures for NR V2X | discussion | Fraunhofer HHI, Fraunhofer IIS | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2001996 | Solutions to remaining opens of physical layer procedures for NR V2X sidelink design | discussion | Intel Corporation | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2002043 | Remaining details on physical procedures for sidelink | other | Futurewei |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2002080 | Remaining issues on physical layer procedures for NR V2X | discussion | CATT |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2002129 | On Physical Layer Procedures for NR Sidelink | discussion | Samsung |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2002207 | Remaining issues on physical layer procedures for sidelink |
discussion revision of R1-2000749 |
CMCC |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2002238 | Physical layer procedures for NR sidelink | other | Ericsson |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2002269 | Remaining issues in physical layer procedures for sidelink | discussion | Spreadtrum Communications | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2002302 | Remaining Issues on Physical Layer Procedures for NR V2X | discussion | InterDigital, Inc. |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |||
| R1-2002327 | On Remaining Details of Physical Layer Procedures for NR V2X Sidelink | discussion | Apple | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2002359 | Remaining issue on physical layer procedures for sidelink in NR V2X | discussion | Panasonic Corporation | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2002363 | Remaining issues on physical layer procedure | discussion | NEC | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
| R1-2002390 | Remaining issues on physical layer procedures for NR sidelink | discussion | Sharp | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
| R1-2002441 | Remaining issues on sidelink physical layer procedure | discussion | NTT DOCOMO, INC. | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | ||
| R1-2002473 | Remaining issues on sidelink physical layer procedure on NR V2X |
discussion revision of R1-2001017 revised to R1-2004345 |
ASUSTeK | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
| R1-2002542 | Physical layer procedures for sidelink | discussion | Qualcomm Incorporated | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
not treated | [WTS] [JSN] | |
| R1-2002759 | Feature lead summary#2 for AI 7.2.4.5 Physical layer procedures for sidelink |
discussion revision of R1-2001892 |
Moderator (LG Electronics) | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
noted | [WTS] [JSN] | |
| R1-2002972 | [Draft] LS on sidelink HARQ operations |
LS out LS To: RAN2 revised to R1-2002985 |
LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
revised | [WTS] [JSN] | |
| R1-2002973 | [Draft] LS on sidelink CSI report |
LS out LS To: RAN2 revised to R1-2002986 |
LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
revised | [WTS] [JSN] | |
| R1-2002985 | LS on sidelink HARQ operations |
LS out LS To: RAN2 revision of R1-2002972 |
RAN1, LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
approved | [WTS] [JSN] | |
| R1-2002986 | LS on sidelink CSI report |
LS out LS To: RAN2 revision of R1-2002973 |
RAN1, LG Electronics | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
approved | [WTS] [JSN] | |
| R1-2003007 | Text proposal from Email discussion thread #1 for AI 7.2.4.5 Physical layer procedures for sidelink | discussion | Moderator (LG Electronics) | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
endorsed | [WTS] [JSN] | |
| R1-2003008 | Text proposal from Email discussion thread #2 for AI 7.2.4.5 Physical layer procedures for sidelink | discussion | Moderator (LG Electronics) | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
endorsed | [WTS] [JSN] | |
| R1-2003009 | Text proposal from Email discussion thread #3 for AI 7.2.4.5 Physical layer procedures for sidelink | discussion | Moderator (LG Electronics) | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
endorsed | [WTS] [JSN] | |
| R1-2003010 | Text proposal from Email discussion thread #4 for AI 7.2.4.5 Physical layer procedures for sidelink | discussion | Moderator (LG Electronics) | 5G_V2X_NRSL-Core | Rel-16 |
R1-ah-34813 AI: 7.2.4.5 |
endorsed | [WTS] [JSN] |
35 documents (0.35194420814514 seconds)