Please enter the search related information in the fields below. Partial information works, e.g. "SP-21
" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501
" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP
" gives the same results as "3gpp
".
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tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
---|---|---|---|---|---|---|---|---|---|
R1-1911882 | Sidelink physical layer structure for NR V2X | other | Huawei, HiSilicon |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1911952 | Discussion of Physical layer structure for sidelink | other | Nokia, Nokia Shanghai Bell |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912020 | Physical layer structure for NR sidelink | discussion | vivo | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1912077 | Control Channel Design and its Efficient Transmission in NR-V2X | discussion | Fujitsu | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1912104 | Discussion on sidelink physical layer structure | discussion | MediaTek Inc. |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912153 | Physical layer structure for NR sidelink | discussion | CATT |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912203 | Physical structure details for NR V2X sidelink communication |
discussion revised to R1-1913255 |
Intel Corporation | Rel-16 |
R1-99 AI: 7.2.4.1 |
revised | [WTS] [JSN] | ||
R1-1912239 | Physical layer structure for sidelink | discussion | TCL Communication Ltd. |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912283 | RS design for NR V2X sidelink | discussion | Mitsubishi Electric RCE | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1912287 | Design of NR V2X Physical Layer Structures | discussion | Fraunhofer HHI, Fraunhofer IIS | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1912322 | Discussion on physical layer structure for NR sidelink | discussion | Lenovo, Motorola Mobility |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912343 | Physical layer structure for NR sidelink | discussion | Sony |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912370 | Physical layer structure for NR V2X | discussion | ITL |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912428 | Remaining details on physical layer structure for the sidelink | other | Futurewei |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912457 | Feature lead summary#1 for agenda item 7.2.4.1 Physical layer structure for sidelink |
discussion revised to R1-1913337 |
Samsung |
R1-99 AI: 7.2.4.1 |
noted | [WTS] [JSN] | |||
R1-1912458 | On Physical Layer Structures for NR V2X | discussion | Samsung |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912514 | NR sidelink physical layer structure | discussion | ZTE, Sanechips |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912575 | Discussion on physical layer structure for sidelink | discussion | Spreadtrum Communications | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1912586 | Discussion on physical layer structure for NR sidelink |
discussion revised to R1-1913235 |
LG Electronics |
R1-99 AI: 7.2.4.1 |
revised | [WTS] [JSN] | |||
R1-1912597 | PHY layer structure for NR sidelink | other | Ericsson |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912615 | Physical layer structure for NR sidelink | discussion | NEC | 5G_V2X_NRSL-Core | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |
R1-1912738 | Physical Layer Structure for NR V2X Sidelink |
discussion revised to R1-1913274 |
InterDigital, Inc. |
R1-99 AI: 7.2.4.1 |
revised | [WTS] [JSN] | |||
R1-1912752 | Discussion on physical layer structure for sidelink in NR V2X |
discussion revision of R1-1910841 |
Panasonic Corporation |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912757 | Physical layer structure for NR sidelink | discussion | Sharp |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912789 | Physical layer structure for NR-V2X | discussion | OPPO |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912810 | On NR V2X Physical Layer Structure | discussion | Apple Inc. |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912839 | Physical layer structure design for sidelink | discussion | AT&T |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1912880 | Sidelink physical layer structure for NR V2X | discussion | NTT DOCOMO, INC. | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1912944 | Considerations on Physical Layer aspects of NR V2X |
discussion revised to R1-1913493 |
Qualcomm Incorporated | 5G_V2X_NRSL-Core | Rel-16 |
R1-99 AI: 7.2.4.1 |
revised | [WTS] [JSN] | |
R1-1913010 | On NR sidelink physical layer structure |
discussion revision of R1-1911306 |
Sequans Communications |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1913020 | Discussion on sidelink structure in NR V2X |
discussion revision of R1-1911208 |
ASUSTEK COMPUTER (SHANGHAI) |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1913074 | Discussion on physical layer structure for 5G V2X | discussion | Xiaomi Communications | 5G_V2X_NRSL-Core | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |
R1-1913156 | Sidelink Physical Layer Structure | discussion | Kyocera Corporation, Continental Automotive GmbH | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1913235 | Discussion on physical layer structure for NR sidelink |
discussion revision of R1-1912586 |
LG Electronics |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1913255 | Physical structure details for NR V2X sidelink communication |
discussion revision of R1-1912203 |
Intel Corporation | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | ||
R1-1913274 | Physical Layer Structure for NR V2X Sidelink |
discussion revision of R1-1912738 |
InterDigital, Inc. |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1913337 | Feature lead summary#2 for agenda item 7.2.4.1 Physical layer structure for sidelink |
discussion revision of R1-1912457 revised to R1-1913488 |
Samsung |
R1-99 AI: 7.2.4.1 |
revised | [WTS] [JSN] | |||
R1-1913488 | Feature lead summary#3 for agenda item 7.2.4.1 Physical layer structure for sidelink |
discussion revision of R1-1913337 revised to R1-1913575 |
Samsung |
R1-99 AI: 7.2.4.1 |
noted | [WTS] [JSN] | |||
R1-1913493 | Considerations on Physical Layer aspects of NR V2X |
discussion revision of R1-1912944 |
Qualcomm Incorporated | 5G_V2X_NRSL-Core | Rel-16 |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |
R1-1913546 | Summary of discussion on PSSCH DMRS patterns and for the number of PSSCH symbols |
discussion revised to R1-1913576 |
Samsung | 5G_V2X_NRSL-Core | Rel-16 |
R1-99 AI: 7.2.4.1 |
revised | [WTS] [JSN] | |
R1-1913575 | Feature lead summary#4 for agenda item 7.2.4.1 Physical layer structure for sidelink |
discussion revision of R1-1913488 |
Samsung |
R1-99 AI: 7.2.4.1 |
not treated | [WTS] [JSN] | |||
R1-1913576 | Summary#2 of discussion on PSSCH DMRS patterns and for the number of PSSCH symbols |
discussion revision of R1-1913546 |
Samsung | 5G_V2X_NRSL-Core | Rel-16 |
R1-99 AI: 7.2.4.1 |
noted | [WTS] [JSN] |
42 documents (0.37109804153442 seconds)