Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".
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| tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
|---|---|---|---|---|---|---|---|---|---|
| R4-2415008 | (NR_LPWUS-Core) Discussion on RRM impact of LP-WUR | discussion | CMCC | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2415066 | Discussion on RRM core requirements for LP-WUS/WUR | discussion | Xiaomi | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2415144 | Further consideration on RRM requirements for LP-WUR | discussion | vivo | NR_LPWUS-Core |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | ||
| R4-2415185 | Discussion on RRM requirements for LP-WUS/WUR | discussion | CATT | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2415364 | Discussion on RRM core requirements for LP-WUS/WUR | discussion | LG Electronics Inc. | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2415541 | On RRM core requirements for LP-WUR | discussion | Apple | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2415692 | RRM impact for Rel-19 LP-WUS/WUR | discussion | SAMSUNG R&D INSTITUTE JAPAN |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |||
| R4-2415738 | Discussion on RRM core requirements for LP-WUS/WUR | discussion | China Telecom | NR_LPWUS-Core |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | ||
| R4-2415865 | Discussion on RRM requirements for LP-WUR | discussion | Huawei, HiSilicon | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2415934 | Discussions on RRM core requirements for LP-WUSWUR | discussion | NTT DOCOMO, INC. | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2416020 | Discussion on LP-WUR RRM requirement | discussion | Ericsson | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2416123 | Discussion on RRM requirements for LP-WUS WUR | other | OPPO | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2416291 | Discussion on LP-WUS RRM core requirements | discussion | Nokia | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2416367 | Discussion on LP-WUS for core part | other | ZTECorporation,Sanechips | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2416469 | RRM requirements for LP-WUR | discussion | Qualcomm Incorporated | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] | |
| R4-2416510 | Discussion on the RRM core requirements for LP-WUS | discussion | MediaTek inc. | NR_LPWUS-Core | Rel-19 |
R4-112-bis AI: 6.23.4.2 |
noted | [WTS] [JSN] |
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