Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".
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| tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
|---|---|---|---|---|---|---|---|---|---|
| R4-1800336 | Peak EIRP for FR2 power class | discussion | Intel Corporation | NR_newRAT |
R4-ah-18779 AI: 4.3.2.1.3 |
noted | [WTS] [JSN] | ||
| R4-1800405 | Compromise proposals for peak EIRP requirement | other | Qualcomm Incorporated, Motorola Mobility, TMO, Sony |
R4-ah-18779 AI: 4.3.2.1.3 |
noted | [WTS] [JSN] | |||
| R4-1800513 | EIRP level of UE power class for mmW | other | LG Electronics France | NR_newRAT-Core | Rel-15 |
R4-ah-18779 AI: 4.3.2.1.3 |
noted | [WTS] [JSN] | |
| R4-1800873 | EIRP requirement, feasibility and associated TRP | report | NXP Semiconductors Netherlands |
R4-ah-18779 AI: 4.3.2.1.3 |
withdrawn | [WTS] [JSN] | |||
| R4-1800889 | Impact of UE back cover material on peak EIRP at mmWave | discussion | Sony, Ericsson |
R4-ah-18779 AI: 4.3.2.1.3 |
noted | [WTS] [JSN] | |||
| R4-1800891 | UE Power class for mmWave | other | Sony, Ericsson |
R4-ah-18779 AI: 4.3.2.1.3 |
noted | [WTS] [JSN] | |||
| R4-1800944 | EIRP requirement, feasibility and associated TRP | report | NXP Semiconductors Netherlands |
R4-ah-18779 AI: 4.3.2.1.3 |
noted | [WTS] [JSN] | |||
| R4-1801106 | WF on for peak EIRP requirement | other | Qualcomm Incorporated |
R4-ah-18779 AI: 4.3.2.1.3 |
approved | [WTS] [JSN] |
8 documents (0.29527688026428 seconds)