Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".

Download results in JSON format

tdoc Title Type / Revs Source Spec / CR S/WID Release Meeting Status Links
R3-237246 Discussion on remaining issue of multi-path relay discussion NEC NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237255 (TP for BLCR 38.473) Multi-path relay other

revised to R3-237821

Huawei NR_SL_relay_enh-Core R3-122

AI: 16.4

revised [WTS] [JSN]
R3-237283 (TPs for SL relay to TS 38.473 and 38.470)Remaining issues on multi-path relay other ZTE NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237298 (TPs for 38.401, 38.473, 38.470) Remaining open issues for multi-path support other

revised to R3-237808

LG Electronics NR_SL_relay_enh-Core R3-122

AI: 16.4

revised [WTS] [JSN]
R3-237321 (TPs for SL Relay to TS 38.401 and TS 38.473) Multi-path for Sidelink Relay other Ericsson NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237365 (TP for TS38.401 BL CR) Inter-DU direct path addition on top of indirect path other

revised to R3-237814

ZTE, NEC, Samsung, Nokia, Nokia Shanghai Bell, Ericsson, LG Electronics, Huawei, CATT NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

revised [WTS] [JSN]
R3-237435 (TP for TS38.474 BL CR) discussion on the support for multi-path other Nokia, Nokia Shanghai Bell NR_SL_relay_enh-Core R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237573 Discussion on multi-path for sidelink relay discussion China Telecommunication NR_SL_relay_enh-Core R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237590 (TP for SL relay 38.401) Discussion on Multi-path Support for SL relay other CATT NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237634 Leftovers for SL relay multipath discussion Samsung NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237635 (TP to BL CR 38.473) SL relay multi-path other Samsung NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237672 (TP to TS 38.401 and TS 38.473) Discussion on multi path relay other CMCC NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237808 (TP for SL Relay BLCR to TS 38.401) Support of multi-path relay other

revision of R3-237298

LG Electronics, Ericsson, ZTE, Nokia, Nokia Shanghai Bell NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

agreed [WTS] [JSN]
R3-237814 (TP for TS38.401 BL CR) Inter-DU direct path addition on top of indirect path other

revision of R3-237365

ZTE, NEC, Samsung, Nokia, Nokia Shanghai Bell, Ericsson, LG Electronics, Huawei, CATT NR_SL_relay_enh-Core Rel-18 R3-122

AI: 16.4

agreed [WTS] [JSN]
R3-237821 (TP for BLCR 38.473) Multi-path relay other

revision of R3-237255

Huawei, LG Electronics, Ericsson, Samsung, Nokia, Nokia Shanghai Bell NR_SL_relay_enh-Core R3-122

AI: 16.4

agreed [WTS] [JSN]
R3-237829 CB:#SLRelay other LGE R3-122

AI: 16.4

noted [WTS] [JSN]
R3-237974 (TP for SL Relay to TS 38.470) Multi-path for Sidelink Relay other Ericsson, LG Electronics, ZTE, Nokia, Nokia Shanghai Bell NR_SL_relay_enh-Core R3-122

AI: 16.4

agreed [WTS] [JSN]

17 documents (0.31876397132874 seconds)