Please enter the search related information in the fields below. Partial information works, e.g. "SP-21
" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501
" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP
" gives the same results as "3gpp
".
Download results in JSON format
tdoc | Title | Type / Revs | Source | Spec / CR | S/WID | Release | Meeting | Status | Links |
---|---|---|---|---|---|---|---|---|---|
S6-190336 | Presentation of Report to SA: TR 23.796 Version 2.0.0 |
TS or TR cover revised to S6-190484 |
Nokia, Nokia Shanghai Bell | FS_FRMCS2 | Rel-16 |
S6-29 AI: 12 |
revised | [WTS] [JSN] | |
S6-190352 | Presentation of Report to TSG: TR 23.784, Version 1.0.0 | TS or TR cover | Motorola Solutions | FS_MCLOG | Rel-16 |
S6-29 AI: 12 |
approved | [WTS] [JSN] | |
S6-190378 | Presentation of Specification to TSG: TS 23.286, Version 0.4.0 |
TS or TR cover revised to S6-190485 |
Huawei, Hisilicon | V2XAPP | Rel-16 |
S6-29 AI: 12 |
revised | [WTS] [JSN] | |
S6-190379 | Work Plan review at SA6#29 |
Work Plan revised to S6-190480 |
Qualcomm Incorporated | Rel-16 |
S6-29 AI: 12 |
revised | [WTS] [JSN] | ||
S6-190407 | Rel-16 Work Item exception for MBMSAPI_MCS | WI exception request | TD Tech | MBMSAPI_MCS | Rel-16 |
S6-29 AI: 12 |
noted | [WTS] [JSN] | |
S6-190408 | TS coversheet for 23.479 |
TS or TR cover revised to S6-190486 |
TD Tech | MBMSAPI_MCS | Rel-16 |
S6-29 AI: 12 |
revised | [WTS] [JSN] | |
S6-190480 | Work Plan review at SA6#29 |
Work Plan revision of S6-190379 revised to S6-190527 |
Qualcomm Incorporated | Rel-16 |
S6-29 AI: 12 |
revised | [WTS] [JSN] | ||
S6-190484 | Presentation of Report to SA: TR 23.796 Version 2.0.0 |
TS or TR cover revision of S6-190336 |
Nokia, Nokia Shanghai Bell | FS_FRMCS2 | Rel-16 |
S6-29 AI: 12 |
approved | [WTS] [JSN] | |
S6-190485 | Presentation of Specification to TSG: TS 23.286, Version 0.4.0 |
TS or TR cover revision of S6-190378 |
Huawei, Hisilicon | V2XAPP | Rel-16 |
S6-29 AI: 12 |
approved | [WTS] [JSN] | |
S6-190486 | TS coversheet for 23.479 |
TS or TR cover revision of S6-190408 |
TD Tech | MBMSAPI_MCS | Rel-16 |
S6-29 AI: 12 |
approved | [WTS] [JSN] | |
S6-190487 | Revised Study MBMSAPI_MCS | SID revised | TD Tech | MBMSAPI_MCS | Rel-16 |
S6-29 AI: 12 |
withdrawn | [WTS] [JSN] | |
S6-190505 | Cover sheet 23.434 SEAL |
TS or TR cover revised to S6-190518 |
Samsung | SEAL | Rel-16 |
S6-29 AI: 12 |
revised | [WTS] [JSN] | |
S6-190518 | Cover sheet 23.434 SEAL |
TS or TR cover revision of S6-190505 |
Samsung | SEAL | Rel-16 |
S6-29 AI: 12 |
approved | [WTS] [JSN] | |
S6-190527 | Work Plan review at SA6#29 |
Work Plan revision of S6-190480 |
Qualcomm Incorporated | Rel-16 |
S6-29 AI: 12 |
noted | [WTS] [JSN] |
14 documents (0.40690207481384 seconds)