Please enter the search related information in the fields below. Partial information works, e.g. "SP-21" in the "tdoc" field lists all TSG SA documents from 2021. Regular expressions mostly work in all fields (e.g. "2[34].501" in the "Spec" field lists all documents related to 23.501 and 24.501. Capitalization is disregarded, i.e. "3GPP" gives the same results as "3gpp".

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tdoc Title Type / Revs Source Spec / CR S/WID Release Meeting Status Links
R3-237187 Conclusion of the discussion on SON for NR-U discussion

revision of R3-235162

Nokia, Nokia Shanghai Bell NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237207 (TP for SON BL CR for TS 38.300): SON for NR-U other Huawei, ZTE, Nokia, Nokia Shanghai Bell, Ericsson, Qualcomm NR_ENDC_SON_MDT_enh2-Core R3-122

AI: 10.2.5

agreed [WTS] [JSN]
R3-237322 Discussion on SON for NR-U other Samsung NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

withdrawn [WTS] [JSN]
R3-237337 (TP for SON BL CR 38.300) Stage 2 clean-up on MRO for NR-U other ZTE NR_ENDC_SON_MDT_enh2-Core R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237404 Discussion on MRO for NR-U discussion Lenovo NR_ENDC_SON_MDT_enh2-Core R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237456 SON enhancements for NR-U discussion Qualcomm Incorporated NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237508 (TP for SON to BLCR for TS 38.300) LBT failures in MRO other

revised to R3-237802

Ericsson, Nokia, Nokia Shanghai Bell, Qualcomm NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

revised [WTS] [JSN]
R3-237509 (TP for SON to BLCR for TS 38.473, TS 38.423) NR-U enhancements for MLB and MRO other Ericsson NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237588 Discussion on SON enhancement for NR-U discussion CATT NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237789 CB:#SONMDT4_NR-U other Ericsson NR_ENDC_SON_MDT_enh2-Core R3-122

AI: 10.2.5

noted [WTS] [JSN]
R3-237802 (TP for SON to BLCR for TS 38.300) LBT failures in MRO other

revision of R3-237508

Ericsson, Samsung, Nokia, Nokia Shanghai Bell, Qualcomm Incorporated NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

agreed [WTS] [JSN]
R3-237803 Ericsson, Samsung, Nokia, Nokia Shanghai Bell, Lenovo, Qualcomm Incorporated other

revised to R3-238002

Ericsson NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

revised [WTS] [JSN]
R3-238002 (TP for SON to BLCR for TS 38.423) LBT failures in MRO other

revision of R3-237803

Ericsson, Samsung, Nokia, Nokia Shanghai Bell, Lenovo, Qualcomm Incorporated NR_ENDC_SON_MDT_enh2-Core Rel-18 R3-122

AI: 10.2.5

agreed [WTS] [JSN]

13 documents (0.43435001373291 seconds)