[{"name":"S3-182854","title":"Dual Connectivity Structure Update","source":"Huawei, Hisilicon","contact":"He Li","contact-id":62828,"tdoctype":"draftCR","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":7,"ainumber":"4.1.4","ainame":"AS security","tdoc_agenda_sort_order":28540,"status":"noted","reservation_date":"2018-09-17 03:25:38","uploaded":"2018-09-17 06:21:20","revisionof":"","revisedto":"","release":"Rel-15","crspec":33.501,"crspecversion":"15.1.0","workitem":[{"winame":"5GS_Ph1-SEC"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG3_Security\/TSGS3_92Bis_Harbin\/Docs\/S3-182854.zip","group":"S3","meeting":"S3-ah-33238","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]