[{"name":"RWS-230461","title":"Overview of RAN4-led Rel-19 topics","source":"Huawei, HiSilicon","contact":"Ye Liu","contact-id":57639,"tdoctype":"discussion","for":"Information","abstract":"","secretary_remarks":"R4","agenda_item_sort_order":6,"ainumber":"6","ainame":"RAN4-led Rel-19 topics","tdoc_agenda_sort_order":1130,"status":"not treated","reservation_date":"2023-05-30 16:42:06","uploaded":"2023-05-31 16:05:01","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/TSG_RAN\/TSGR_AHs\/2023_06_RAN_Rel19_WS\/Docs\/RWS-230461.zip","group":"RP","meeting":"RP-0-Release 19 work","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]