[{"name":"RWS-230319","title":"Overview of Release 19 proposals","source":"Huawei, HiSilicon","contact":"David Mazzarese","contact-id":44044,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"vd","agenda_item_sort_order":4,"ainumber":"4","ainame":"High-level overview proposals for Rel-19","tdoc_agenda_sort_order":2190,"status":"not treated","reservation_date":"2023-05-30 06:49:53","uploaded":"2023-05-31 16:18:12","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/TSG_RAN\/TSGR_AHs\/2023_06_RAN_Rel19_WS\/Docs\/RWS-230319.zip","group":"RP","meeting":"RP-0-Release 19 work","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]