[{"name":"RP-171039","title":"Revised WID for Performance enhancements for high speed scenario in LTE","source":"NTT DOCOMO, INC., Huawei, HiSilicon","contact":"Takuma Takada","contact-id":70194,"tdoctype":"WID revised","for":"Approval","abstract":"moved from AI 10.7.4 to AI 10.3.3; last approved WID: RP-160172","secretary_remarks":"R4","agenda_item_sort_order":51,"ainumber":"10.3.3","ainame":"Perf. Part: Performance enhancements for high speed scenario in LTE [LTE_high_speed-Perf]","tdoc_agenda_sort_order":12570,"status":"approved","reservation_date":"2017-05-26 01:30:09","uploaded":"2017-05-29 08:21:48","revisionof":"","revisedto":"","release":"Rel-14","crspec":"","crspecversion":"","workitem":[{"winame":"LTE_high_speed-Perf"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/TSG_RAN\/TSGR_76\/Docs\/RP-171039.zip","group":"RP","meeting":"RP-76","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]