[{"name":"R3-202292","title":"(TP for NR_Mob_enh-Core BL CR for TS 38.401): DAPS HO handling during preparation","source":"Intel Corporation","contact":"Jaemin Han","contact-id":84060,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":111,"ainumber":"15.2.1","ainame":"Common","tdoc_agenda_sort_order":51100,"status":"available","reservation_date":"2020-04-09 19:46:29","uploaded":"2020-04-10 04:13:53","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_107bis_e\/Docs\/R3-202292.zip","group":"R3","meeting":"R3-ah-38074","year":2020,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]