[{"name":"R2-2306886","title":"Introduction of intra-band EN-DC contiguous capability for UL","source":"Huawei, HiSilicon, Nokia, Nokia Shanghai Bell, Qualcomm Incorporated, Intel Corporation, ZTE Corporation, Sanechips, MediaTek inc","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":63,"ainumber":"6.1.3.2","ainame":"UE capabilities","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2023-06-02 12:50:07","uploaded":"2023-06-02 12:51:13","revisionof":"R2-2306511","revisedto":"R2-2308860","release":"Rel-16","crspec":38.331,"crspecversion":"16.12.0","workitem":[{"winame":"TEI17"},{"winame":" NR_newRAT-Core"}],"crnumber":4157.0,"crrevision":1.0,"crcategory":"A","tsg_crp":"RP-231417","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_122\/Docs\/R2-2306886.zip","group":"R2","meeting":"R2-122","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]