[{"name":"R2-1703269","title":"LPP clean-up","source":"Qualcomm Incorporated","contact":"Sven Fischer","contact-id":20628,"tdoctype":"CR","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":65,"ainumber":"8.25","ainame":"LTE TEI14 enhancements","tdoc_agenda_sort_order":35011,"status":"revised","reservation_date":"2017-03-24 11:30:12","uploaded":"2017-03-24 17:27:06","revisionof":"","revisedto":"R2-1703823","release":"Rel-14","crspec":36.355,"crspecversion":"14.1.0","workitem":[{"winame":"TEI14"}],"crnumber":176.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_97bis\/Docs\/R2-1703269.zip","group":"R2","meeting":"R2-97","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]