[{"name":"R2-1700466","title":"Forward compatible robust design features in NR","source":"Samsung Electronics Co., Ltd","contact":"Seung-hoon Park","contact-id":58554,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":27,"ainumber":"3.2.3","ainame":"Other architectural aspects","tdoc_agenda_sort_order":4660,"status":"available","reservation_date":"2017-01-06 15:50:31","uploaded":"2017-01-06 16:26:11","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_AHs\/2017_01_NR\/Docs\/R2-1700466.zip","group":"R2","meeting":"R2-ah-18513","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]