[{"name":"R1-2112231","title":"TB processing over multi-slot PUSCH","source":"Qualcomm Incorporated","contact":"Peter Gaal","contact-id":57198,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":76,"ainumber":"8.8.1.2","ainame":"TB processing over multi-slot PUSCH","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2021-11-05 05:44:15","uploaded":"2021-11-06 04:46:47","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_cov_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_107-e\/Docs\/R1-2112231.zip","group":"R1","meeting":"R1-107-e","year":2021,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]