[{"name":"R1-2110235","title":"Rel-17 TEI","source":"Qualcomm Incorporated","contact":"Peter Gaal","contact-id":57198,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":121,"ainumber":"8.18","ainame":"Other","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2021-10-01 04:19:42","uploaded":"2021-10-02 04:14:21","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"TEI17"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_106b-e\/Docs\/R1-2110235.zip","group":"R1","meeting":"R1-106-bis-e","year":2021,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]