[{"name":"R1-1911854","title":"PHY aspects for DAPS HO","source":"Huawei, HiSilicon","contact":"Yan Cheng","contact-id":58585,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":116,"ainumber":"7.2.12.1","ainame":"Physical Layer Aspects for Mobility Enhancements during HO and SCG Change","tdoc_agenda_sort_order":18540,"status":"not treated","reservation_date":"2019-10-30 09:32:57","uploaded":"2019-11-09 04:31:31","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_99\/Docs\/R1-1911854.zip","group":"R1","meeting":"R1-99","year":2019,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]