[{"name":"R1-1905624","title":"Feature lead summary for agenda item 7.2.4.5 Physical layer procedures for sidelink","source":"LG Electronics","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":82,"ainumber":"7.2.4.5","ainame":"Physical layer procedures for sidelink","tdoc_agenda_sort_order":562400,"status":"revised","reservation_date":"2019-04-08 23:33:35","uploaded":"2019-04-11 01:31:19","revisionof":"","revisedto":"R1-1905892","release":"Rel-16","crspec":"","crspecversion":"","workitem":[{"winame":"5G_V2X_NRSL-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_96b\/Docs\/R1-1905624.zip","group":"R1","meeting":"R1-96","year":2019,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]