[{"name":"R1-1708546","title":"TP on impact on specifications","source":"Huawei, HiSilicon","contact":"Carmela Cozzo","contact-id":55181,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"5.2.2","ainame":"Impact on specifications","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2017-05-05 05:27:27","uploaded":"2017-05-06 12:27:58","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1708546.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]