[{"name":"R1-160038","title":"Uplink frame structure design","source":"Huawei, HiSilicon","contact":"Brian Classon","contact-id":45750,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":12,"ainumber":"2.1.2.1","ainame":"Data channel","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2016-01-05 08:14:01","uploaded":"2016-01-12 00:50:38","revisionof":"","revisedto":"R1-160183","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1601\/Docs\/R1-160038.zip","group":"R1","meeting":"R1-ah-31964","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]