[{"name":"C1-203094","title":"eIMS5G_nonSBA SID","source":"Huawei, HiSilicon","contact":"haitao Wei","contact-id":48249,"tdoctype":"SID new","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":89,"ainumber":"17.1.1","ainame":"Work Item Descriptions","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2020-05-22 01:16:16","uploaded":"2020-05-26 08:46:05","revisionof":"","revisedto":"C1-204086","release":"Rel-17","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ct\/WG1_mm-cc-sm_ex-CN1\/TSGC1_124e\/Docs\/C1-203094.zip","group":"C1","meeting":"C1-ah-38162","year":2020,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]