[{"name":"S4-220975","title":"Follow-up on TR 26.955: HEVC Improvements","source":"Qualcomm incorporated","contact":"Thomas Stockhammer","contact-id":60397,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"9.9","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":9750,"status":"noted","reservation_date":"2022-08-10 11:36:34","uploaded":"2022-08-11 21:10:12","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_120-e\/Docs\/S4-220975.zip","group":"S4","meeting":"S4-120-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]