[{"name":"R4-2107299","title":"On feasibility of RF component to support FDD HPUE","source":"Huawei, HiSilicon","contact":"Ye Liu","contact-id":57639,"tdoctype":"other","for":"Approval","abstract":"","secretary_remarks":"[98bis-e][143] FS_NR_PC2_UE_FDD","agenda_item_sort_order":546,"ainumber":"9.4.4","ainame":"UE implementation issues","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2021-04-02 20:06:07","uploaded":"2021-04-02 22:04:25","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"FS_NR_PC2_UE_FDD"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_98bis_e\/Docs\/R4-2107299.zip","group":"R4","meeting":"R4-98-bis-e","year":2021,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2107354","title":"UE related considerations for PC2 FDD","source":"Qualcomm Incorporated","contact":"Gene Fong","contact-id":42643,"tdoctype":"discussion","for":"Approval","abstract":"","secretary_remarks":"[98bis-e][143] FS_NR_PC2_UE_FDD","agenda_item_sort_order":546,"ainumber":"9.4.4","ainame":"UE implementation issues","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2021-04-02 21:56:51","uploaded":"2021-04-02 23:05:03","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"FS_NR_PC2_UE_FDD"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_98bis_e\/Docs\/R4-2107354.zip","group":"R4","meeting":"R4-98-bis-e","year":2021,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]