[{"name":"R4-1712265","title":"Discussion on NR FR2 MPR","source":"Samsung","contact":"Haijie Qiu","contact-id":46265,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":289,"ainumber":"9.4.3.3.2","ainame":"[FR2] MPR evaluation [NR_newRAT]","tdoc_agenda_sort_order":226500,"status":"noted","reservation_date":"2017-11-15 06:43:51","uploaded":"2017-11-17 12:11:44","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_85\/Docs\/R4-1712265.zip","group":"R4","meeting":"R4-85","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1712330","title":"MPR simulation results for FR2","source":"Intel Corporation","contact":"Yang Tang","contact-id":56725,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":289,"ainumber":"9.4.3.3.2","ainame":"[FR2] MPR evaluation [NR_newRAT]","tdoc_agenda_sort_order":233000,"status":"noted","reservation_date":"2017-11-16 00:58:24","uploaded":"2017-11-17 21:53:16","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_85\/Docs\/R4-1712330.zip","group":"R4","meeting":"R4-85","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]