[{"name":"R1-2405802","title":"Discussion on physical layer design for Rel-19 Ambient IoT devices","source":"FUTUREWEI","contact":"Brian Classon","contact-id":104757,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-07-23 00:01:51","uploaded":"2024-08-09 15:55:49","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405802.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2405820","title":"General aspects of physical layer design for Ambient IoT","source":"Nokia","contact":"Torsten Wildschek","contact-id":82471,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-07-24 09:47:46","uploaded":"2024-08-09 21:57:54","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405820.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2405826","title":"General aspects of physical layer design for Ambient IoT","source":"Ericsson","contact":"Johan Bergman","contact-id":51222,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-07-24 14:48:18","uploaded":"2024-08-09 18:36:42","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405826.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2405852","title":"On general aspects of physical layer design for Ambient IoT","source":"Huawei, HiSilicon","contact":"Yan Cheng","contact-id":58585,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-07-26 08:13:46","uploaded":"2024-08-09 21:21:16","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405852.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2405912","title":"Discussion\u00a0on\u00a0general\u00a0aspects\u00a0of\u00a0physical\u00a0layer\u00a0design for\u00a0Ambient\u00a0IoT","source":"Spreadtrum Communications","contact":"Yu Ding","contact-id":90667,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-07-30 01:58:58","uploaded":"2024-08-09 11:44:19","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405912.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2405968","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"TCL","contact":"Rongling Jian","contact-id":105130,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-02 08:07:02","uploaded":"2024-08-09 07:40:40","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405968.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2405989","title":"Discussion on general aspects of A-IoT physical layer design","source":"CMCC","contact":"FEI WANG","contact-id":80497,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-02 08:57:23","uploaded":"2024-08-09 15:19:19","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2405989.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406082","title":"Discussion on Physical Layer Design for Ambient-IoT","source":"EURECOM","contact":"Sebastian Wagner","contact-id":91812,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-05 14:11:02","uploaded":"2024-08-09 21:09:05","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406082.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406091","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"China Telecom","contact":"Nanxi LI","contact-id":96136,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-06 00:31:36","uploaded":"2024-08-09 07:33:19","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406091.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406186","title":"Discussion on General Aspects of Physical Layer Design","source":"vivo","contact":"Xueming Pan","contact-id":103652,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-06 16:15:41","uploaded":"2024-08-09 15:24:36","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406186.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406242","title":"Discussion on general aspects of physical layer design of A-IoT communication","source":"OPPO","contact":"Zhihua SHI","contact-id":67442,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 02:18:14","uploaded":"2024-08-09 11:13:20","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406242.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406288","title":"Discussion on physical layer design of Ambient IoT","source":"Xiaomi","contact":"wensu zhao","contact-id":89394,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 04:36:50","uploaded":"2024-08-09 12:56:48","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406288.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406315","title":"Consideration on general aspects of physical layer","source":"Fujitsu","contact":"Lei Zhang","contact-id":108676,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 06:10:10","uploaded":"2024-08-09 11:34:49","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406315.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406372","title":"Discussion on general aspects of physical layer design","source":"CATT","contact":"Min Zhu","contact-id":88538,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 06:25:13","uploaded":"2024-08-09 14:49:14","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406372.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406405","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"ZTE Corporation, Sanechips","contact":"Mengzhu Chen","contact-id":80650,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 08:07:21","uploaded":"2024-08-09 16:50:41","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406405.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406445","title":"On General Physical Layer Design Considerations for Ambient IoT (internet of things) Applications","source":"Lekha Wireless Solutions","contact":"Abhinaba Dey","contact-id":102808,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 12:06:02","uploaded":"2024-08-09 07:12:13","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406445.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406474","title":"General aspects of Ambient IoT physical layer design","source":"Sony","contact":"Martin Beale","contact-id":82077,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-07 14:39:10","uploaded":"2024-08-09 21:38:48","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406474.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406557","title":"Discussion on general aspects of ambient IoT physical layer design","source":"NEC","contact":"Wang Gang","contact-id":43643,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 02:58:12","uploaded":"2024-08-09 09:20:09","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406557.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406600","title":"General aspects of physical layer design for Ambient IoT","source":"Panasonic","contact":"Shotaro Maki","contact-id":69884,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 07:06:23","uploaded":"2024-08-09 04:42:39","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406600.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406604","title":"General aspects of Ambient IoT physical layer design","source":"LG Electronics","contact":"Sukchel Yang","contact-id":45767,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 07:17:10","uploaded":"2024-08-09 17:46:54","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406604.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406654","title":"Considerations on general aspects of Ambient IoT","source":"Samsung","contact":"Hyoungju Ji","contact-id":82213,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 08:00:10","uploaded":"2024-08-09 15:22:05","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406654.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406728","title":"Discussion on general aspects of physical layer design","source":"ETRI","contact":"Junghoon Lee","contact-id":88130,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 12:54:54","uploaded":"2024-08-09 16:18:38","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406728.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406773","title":"General aspects of physical layer design","source":"MediaTek Inc.","contact":"Tao Chen","contact-id":56050,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 15:27:45","uploaded":"2024-08-09 13:18:17","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406773.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406813","title":"Discussion on the physical layer design aspects for Ambient IoT devices","source":"Lenovo","contact":"Karthikeyan Ganesan","contact-id":84218,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 21:29:07","uploaded":"2024-08-09 18:07:54","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406813.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406840","title":"On general physical layer design aspects for AIoT","source":"Apple","contact":"Wei Zeng","contact-id":101955,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-08 22:17:57","uploaded":"2024-08-09 23:09:27","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406840.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406878","title":"Discussion on general aspects of physical layer design","source":"Sharp","contact":"XiaoJun Ma","contact-id":88620,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 00:07:53","uploaded":"2024-08-09 08:31:30","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406878.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406892","title":"On the general aspects of physical layer design for Ambient IoT","source":"InterDigital, Inc.","contact":"Erdem Bala","contact-id":100407,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 01:33:49","uploaded":"2024-08-09 22:17:34","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406892.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2406934","title":"Study on general aspects of physical layer design for Ambient IoT","source":"NTT DOCOMO, INC.","contact":"Shinya Kumagai","contact-id":91543,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 03:01:58","uploaded":"2024-08-09 10:07:18","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2406934.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407033","title":"General aspects of physical layer design","source":"Qualcomm Incorporated","contact":"Peter Gaal","contact-id":57198,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 04:24:57","uploaded":"2024-08-09 23:18:31","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2407033.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407088","title":"Discussion on General aspects of physical layer design","source":"CEWiT","contact":"Pardhasarathy Jyothi","contact-id":76750,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 06:38:14","uploaded":"2024-08-09 23:47:29","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2407088.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407119","title":"General aspects of physical layer design for Ambient IoT","source":"ITL","contact":"Donghyun Park","contact-id":58631,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 08:27:03","uploaded":"2024-08-09 08:31:36","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2407119.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407131","title":"Discussion on General aspects of physical layer design of AIoT","source":"IIT Kanpur, Indian Institute of Tech (M)","contact":"Jyotirmay Saini","contact-id":94284,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-08-09 09:12:39","uploaded":"2024-08-09 20:37:42","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2407131.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407248","title":"Feature Lead Summary #1 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-08-16 17:24:19","uploaded":"2024-08-21 20:21:08","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2407248.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407249","title":"Feature Lead Summary #2 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-08-16 17:24:19","uploaded":"2024-08-21 20:21:08","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118\/Docs\/R1-2407249.zip","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407250","title":"Feature Lead Summary #3 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"withdrawn","reservation_date":"2024-08-16 17:24:19","uploaded":null,"revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"","group":"R1","meeting":"R1-118","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407610","title":"Discussion on physical layer design for Rel-19 Ambient IoT devices","source":"FUTUREWEI","contact":"Brian Classon","contact-id":104757,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-20 00:00:29","uploaded":"2024-10-04 19:36:15","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407610.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407628","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"TCL","contact":"Rongling Jian","contact-id":105130,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-20 05:49:44","uploaded":"2024-10-04 01:35:40","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407628.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407638","title":"General aspects of physical layer design for Ambient IoT","source":"Ericsson","contact":"Johan Bergman","contact-id":51222,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-20 10:19:55","uploaded":"2024-10-04 20:40:25","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407638.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407645","title":"General aspects of physical layer design for Ambient IoT","source":"Nokia","contact":"Torsten Wildschek","contact-id":82471,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-20 13:52:20","uploaded":"2024-10-04 23:51:52","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407645.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407669","title":"On general aspects of physical layer design for Ambient IoT","source":"Huawei, HiSilicon","contact":"Yan Cheng","contact-id":58585,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-20 16:56:03","uploaded":"2024-10-04 23:10:54","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407669.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407707","title":"Discussion\u00a0on\u00a0general\u00a0aspects\u00a0of\u00a0physical\u00a0layer\u00a0design for\u00a0Ambient\u00a0IoT","source":"Spreadtrum Communications","contact":"Yu Ding","contact-id":90667,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-22 23:53:12","uploaded":"2024-10-04 11:29:35","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407707.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407734","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"China Telecom","contact":"Nanxi LI","contact-id":96136,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-23 03:20:53","uploaded":"2024-09-30 12:48:09","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407734.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407862","title":"Discussion on General Aspects of Physical Layer Design","source":"vivo","contact":"Xueming Pan","contact-id":103652,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-26 03:45:52","uploaded":"2024-10-04 14:56:57","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407862.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407906","title":"Discussion on general aspects of A-IoT physical layer design","source":"CMCC","contact":"FEI WANG","contact-id":80497,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-26 08:56:38","uploaded":"2024-10-01 12:32:20","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407906.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2407970","title":"Discussion on physical layer design of Ambient IoT","source":"Xiaomi","contact":"Teng Ma","contact-id":106478,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-27 02:35:03","uploaded":"2024-10-04 02:04:21","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2407970.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408048","title":"Discussion on general aspects of physical layer design","source":"CATT","contact":"Min Zhu","contact-id":88538,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-27 05:50:24","uploaded":"2024-09-30 12:55:03","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408048.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408067","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"ZTE Corporation, Sanechips","contact":"Mengzhu Chen","contact-id":80650,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2024-09-27 06:16:57","uploaded":"2024-10-04 13:40:38","revisionof":"","revisedto":"R1-2409005","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408067.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408147","title":"Discussion on general aspects of physical layer design of A-IoT communication","source":"OPPO","contact":"Kevin Lin","contact-id":74926,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-29 09:55:27","uploaded":"2024-10-04 14:06:14","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408147.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408206","title":"Discussion on general aspects of ambient IoT physical layer design","source":"NEC","contact":"Wang Gang","contact-id":43643,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-30 02:09:02","uploaded":"2024-10-04 12:52:36","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408206.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408250","title":"Discussion on general aspects of physical layer design","source":"Sharp","contact":"XiaoJun Ma","contact-id":88620,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-30 07:04:50","uploaded":"2024-10-04 08:07:59","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408250.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408272","title":"Discussion on Physical Layer Design for Ambient-IoT","source":"EURECOM","contact":"Sebastian Wagner","contact-id":91812,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-09-30 13:28:58","uploaded":"2024-10-04 11:27:50","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408272.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408308","title":"On General Physical Layer Design Considerations for Ambient IoT Applications","source":"Lekha Wireless Solutions","contact":"Roshan Sam","contact-id":102891,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-01-10 12:01:49","uploaded":"2024-10-04 07:10:00","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408308.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408410","title":"General aspects of Ambient IoT physical layer design","source":"Sony","contact":"Martin Beale","contact-id":82077,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-02-10 19:58:10","uploaded":"2024-10-04 23:13:05","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408410.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408466","title":"On remaining general physical layer design aspects for AIoT","source":"Apple","contact":"Wei Zeng","contact-id":101955,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-02-10 23:23:04","uploaded":"2024-10-04 22:10:06","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408466.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408568","title":"Discussion on general aspects of physical layer design","source":"ETRI","contact":"Junghoon Lee","contact-id":88130,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 09:06:50","uploaded":"2024-10-04 15:12:58","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408568.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408599","title":"General aspects of physical layer design for Ambient IoT","source":"Panasonic","contact":"Shotaro Maki","contact-id":69884,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 10:10:21","uploaded":"2024-10-04 08:32:19","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408599.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408647","title":"Considerations for general aspects of Ambient IoT","source":"Samsung","contact":"Hyoungju Ji","contact-id":82213,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 14:23:26","uploaded":"2024-10-04 13:47:18","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408647.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408672","title":"General aspects of Ambient IoT physical layer design","source":"LG Electronics","contact":"Sukchel Yang","contact-id":45767,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 15:10:55","uploaded":"2024-10-04 14:56:30","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408672.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408685","title":"Discussion on physical layer design for Ambient IoT","source":"Comba","contact":"Lin Chen","contact-id":96033,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 15:27:31","uploaded":"2024-10-04 03:19:57","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408685.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408701","title":"General aspects of physical layer design","source":"MediaTek Inc.","contact":"Tim Frost","contact-id":90797,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 16:50:19","uploaded":"2024-10-04 18:40:49","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408701.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408730","title":"On the general aspects of physical layer design for Ambient IoT","source":"InterDigital, Inc.","contact":"Erdem Bala","contact-id":100407,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-03-10 20:07:13","uploaded":"2024-10-04 20:26:21","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408730.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408765","title":"Discussion on A-IoT physical layer design","source":"ASUSTeK","contact":"Mingche Li","contact-id":53966,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-04-10 02:03:45","uploaded":"2024-10-04 07:54:45","revisionof":"","revisedto":"R1-2410372","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408765.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408787","title":"Study on general aspects of physical layer design for Ambient IoT","source":"NTT DOCOMO, INC.","contact":"Shinya Kumagai","contact-id":91543,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-04-10 02:56:40","uploaded":"2024-10-04 11:30:04","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408787.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408851","title":"General aspects of physical layer design","source":"Qualcomm Incorporated","contact":"Peter Gaal","contact-id":57198,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-04-10 05:14:41","uploaded":"2024-10-04 21:37:51","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408851.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408875","title":"Discussion on multiple access for D2R","source":"LG Uplus","contact":"Yunsung Kim","contact-id":72004,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-04-10 06:00:24","uploaded":"2024-10-04 07:41:13","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408875.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408941","title":"Discussion on General aspects of physical layer design of AIoT","source":"IIT Kanpur, Indian Institute of Tech (M)","contact":"Jyotirmay Saini","contact-id":94284,"tdoctype":"discussion","for":"Decision","abstract":"Brief description of document content.","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-04-10 10:48:56","uploaded":"2024-10-04 18:44:44","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408941.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2408967","title":"Discussion on the physical layer design aspects for Ambient IoT devices","source":"Lenovo","contact":"Karthikeyan Ganesan","contact-id":84218,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-04-10 13:55:47","uploaded":"2024-10-04 20:34:08","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2408967.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2409005","title":"Discussion on general aspects of physical layer design for Ambient IoT","source":"ZTE Corporation, Sanechips","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"not treated","reservation_date":"2024-07-10 16:31:34","uploaded":"2024-10-14 23:41:05","revisionof":"R1-2408067","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2409005.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2409070","title":"Feature Lead Summary #1 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-12-10 08:02:54","uploaded":"2024-10-14 23:41:05","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2409070.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2409071","title":"Feature Lead Summary #2 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-12-10 08:02:54","uploaded":"2024-10-16 23:31:04","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2409071.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2409072","title":"Feature Lead Summary #3 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-12-10 08:02:54","uploaded":"2024-10-17 23:31:04","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2409072.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2409259","title":"Feature Lead Summary #4 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-10-16 23:56:17","uploaded":"2024-10-19 01:21:04","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2409259.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R1-2409311","title":"Feature Lead Summary #5 for 9.4.2.1: \u201cAmbient IoT \u2013 General aspects of physical layer design\u201d","source":"Moderator (Huawei)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":33,"ainumber":"9.4.2.1","ainame":"General aspects of physical layer design","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-10-18 06:37:10","uploaded":"2024-10-19 01:21:04","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"FS_Ambient_IoT_solutions"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_118b\/Docs\/R1-2409311.zip","group":"R1","meeting":"R1-118-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]