[{"name":"S4-230817","title":"On HEVC Extensions","source":"Qualcomm Tech. Netherlands B.V","contact":"Thomas Stockhammer","contact-id":60397,"tdoctype":"WID new","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-05-15 19:40:04","uploaded":"2023-05-16 19:15:26","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-230817.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-230855","title":"Discussion on new Feasibility Study on new HEVC profiles and operating points","source":"Apple","contact":"Waqar Zia","contact-id":99429,"tdoctype":"discussion","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-05-16 08:46:53","uploaded":"2023-05-16 18:38:39","revisionof":"","revisedto":"S4-230952","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-230855.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-230856","title":"New Feasibility Study on new HEVC profiles and operating points","source":"Apple, Dolby Laboratories Inc., Fraunhofer HHI, Nokia, Ateme","contact":"Waqar Zia","contact-id":99429,"tdoctype":"SID new","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-05-16 08:46:53","uploaded":"2023-05-16 18:38:39","revisionof":"S4-230663","revisedto":"S4-231072","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-230856.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-230922","title":"Proposed revision of New Feasibility Study on new HEVC profiles and operating points","source":"Dolby Laboratories Inc., InterDigital Communications","contact":"Frederic Gabin","contact-id":88223,"tdoctype":"SID new","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-05-16 20:03:40","uploaded":"2023-05-16 20:50:37","revisionof":"","revisedto":"S4-231002","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-230922.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-230952","title":"Discussion on new Feasibility Study on new HEVC profiles and operating points. Update of S4-230855.","source":"Apple AB","contact":"Dimitri Podborski","contact-id":97971,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-05-16 22:16:28","uploaded":"2023-05-16 22:30:27","revisionof":"S4-230855","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-230952.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-231002","title":"New Feasibility Study on Film Grain synthesis","source":"Dolby Laboratories Inc., InterDigital Communications, Orange, Qualcomm, Xiaomi, Ateme","contact":"Frederic Gabin","contact-id":88223,"tdoctype":"SID new","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-05-24 07:42:51","uploaded":"2023-05-24 08:51:44","revisionof":"S4-230922","revisedto":"S4-231034","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-231002.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-231034","title":"New Feasibility Study on Film Grain synthesis","source":"Dolby Laboratories Inc., InterDigital Communications, Orange, Qualcomm, Xiaomi, Ateme, AT&T","contact":"Frederic Gabin","contact-id":88223,"tdoctype":"SID new","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-05-25 05:04:47","uploaded":"2023-05-26 15:11:08","revisionof":"S4-231002","revisedto":"S4-231060","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-231034.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"S4-231060","title":"New Feasibility Study on Film Grain synthesis","source":"Dolby Laboratories Inc., InterDigital Communications, Orange, Qualcomm, Xiaomi, Ateme, AT&T, Fraunhofer HHI","contact":"Frederic Gabin","contact-id":88223,"tdoctype":"SID new","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":51,"ainumber":"9.1","ainame":"New Work \/ New Work Items and Study Items","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-05-25 09:18:51","uploaded":"2023-05-26 15:11:08","revisionof":"S4-231034","revisedto":"S4-231073","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG4_CODEC\/TSGS4_124_Berlin\/Docs\/S4-231060.zip","group":"S4","meeting":"S4-124","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]