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{"name":"R2-2202392","title":"Discussion on SRAP for L2 U2N relay","source":"Huawei, HiSilicon","contact":"Yulong Shi","contact-id":78274,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":130,"ainumber":"8.7.2.3","ainame":"Adaptation layer design","tdoc_agenda_sort_order":23920,"status":"available","reservation_date":"2022-02-11 09:23:22","uploaded":"2022-02-14 10:53:34","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_117-e\/Docs\/R2-2202392.zip","group":"R2","meeting":"R2-117-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2202429","title":"Remaining issues of the adaptation layer","source":"Ericsson","contact":"Min Wang","contact-id":88470,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":130,"ainumber":"8.7.2.3","ainame":"Adaptation layer design","tdoc_agenda_sort_order":24290,"status":"available","reservation_date":"2022-02-11 12:06:18","uploaded":"2022-02-14 16:14:30","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_117-e\/Docs\/R2-2202429.zip","group":"R2","meeting":"R2-117-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2202675","title":"Remaining issue on sidelink adaptation layer","source":"Qualcomm Incorporated","contact":"Peng Cheng","contact-id":79645,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":130,"ainumber":"8.7.2.3","ainame":"Adaptation layer design","tdoc_agenda_sort_order":26750,"status":"available","reservation_date":"2022-02-13 01:45:00","uploaded":"2022-02-14 13:07:51","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_117-e\/Docs\/R2-2202675.zip","group":"R2","meeting":"R2-117-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2202854","title":"SRAP header format design","source":"CMCC","contact":"Ningyu Chen","contact-id":62843,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":130,"ainumber":"8.7.2.3","ainame":"Adaptation layer design","tdoc_agenda_sort_order":28540,"status":"withdrawn","reservation_date":"2022-02-14 02:40:14","uploaded":null,"revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"","group":"R2","meeting":"R2-117-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2202897","title":"Discussion on UE's L2 ID","source":"Sharp","contact":"Lei Liu","contact-id":89429,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":130,"ainumber":"8.7.2.3","ainame":"Adaptation layer design","tdoc_agenda_sort_order":28970,"status":"available","reservation_date":"2022-02-14 03:44:22","uploaded":"2022-02-14 08:18:04","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_117-e\/Docs\/R2-2202897.zip","group":"R2","meeting":"R2-117-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2203172","title":"SRAP - miscellaneous issues","source":"Samsung Electronics GmbH","contact":"Milos Tesanovic","contact-id":66723,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":130,"ainumber":"8.7.2.3","ainame":"Adaptation layer design","tdoc_agenda_sort_order":31720,"status":"available","reservation_date":"2022-02-14 10:23:15","uploaded":"2022-02-14 15:07:41","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_117-e\/Docs\/R2-2203172.zip","group":"R2","meeting":"R2-117-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]