[{"name":"R2-2200008","title":"Remaining open issues for eIAB","source":"Qualcomm (WI Rapporteur)","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"discussion","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":80,"status":"revised","reservation_date":"2022-01-05 22:21:29","uploaded":"2022-01-05 22:25:10","revisionof":"","revisedto":"R2-2200023","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200008.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200023","title":"Remaining open issues for eIAB","source":"Qualcomm (WI Rapporteur)","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"discussion","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":230,"status":"noted","reservation_date":"2022-01-05 22:21:30","uploaded":"2022-01-05 22:25:09","revisionof":"R2-2200008","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200023.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200065","title":"Reply LS on Inter-donor migration (R1-2108529; contact: Huawei)","source":"RAN1","contact":"Xinghua Song","contact-id":71380,"tdoctype":"LS in","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":650,"status":"noted","reservation_date":"2022-01-05 23:30:49","uploaded":"2022-01-05 23:42:18","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"R3-212981","lsto":"RAN3, RAN4","Cc":"RAN2","lsoriginalls":"R1-2108529","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200065.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200094","title":"LS on range of power control parameters for eIAB (R1-2112973; contact: Qualcomm)","source":"RAN1","contact":"Luca Blessent","contact-id":83514,"tdoctype":"LS in","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2022-01-05 23:30:49","uploaded":"2022-01-05 23:42:17","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"RAN4","Cc":"RAN2","lsoriginalls":"R1-2112973","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200094.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200100","title":"LS on BAP- and RRC-related agreements from RAN3#113-e (R3-214476; contact: Ericsson)","source":"RAN3","contact":"Filip Barac","contact-id":76369,"tdoctype":"LS in","for":"Action","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":1000,"status":"noted","reservation_date":"2022-01-05 23:30:50","uploaded":"2022-01-05 23:42:18","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"RAN2","Cc":"","lsoriginalls":"R3-214476","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200100.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200115","title":"Reply LS on inter-donor migration (R4-2115354; contact: ZTE)","source":"RAN4","contact":"Richie Leo","contact-id":92980,"tdoctype":"LS in","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":1150,"status":"noted","reservation_date":"2022-01-05 23:30:50","uploaded":"2022-01-05 23:42:18","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"R3-212981","lsto":"RAN3","Cc":"RAN1, RAN2","lsoriginalls":"R4-2115354","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200115.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200194","title":"Updated Rel-17 IAB Workplan","source":"Qualcomm Incorporated, Samsung (WI rapporteurs)","contact":"Georg Hampel","contact-id":75627,"tdoctype":"Work Plan","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":1940,"status":"noted","reservation_date":"2022-01-06 22:17:28","uploaded":"2022-01-10 19:31:28","revisionof":"R2-2109939","revisedto":"R2-2202327","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200194.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2200805","title":"Running CR to 37.340 for eIAB","source":"vivo","contact":"Boubacar Kimba","contact-id":72224,"tdoctype":"draftCR","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":8050,"status":"available","reservation_date":"2022-01-10 09:28:38","uploaded":"2022-01-11 10:25:56","revisionof":"","revisedto":"","release":"Rel-17","crspec":37.34,"crspecversion":"16.8.0","workitem":[{"winame":"NR_IAB-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2200805.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201303","title":"Running CR of TS 38.340 for eIAB Option1","source":"Huawei, HiSilicon","contact":"Yulong Shi","contact-id":78274,"tdoctype":"draftCR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":13030,"status":"revised","reservation_date":"2022-01-11 02:22:53","uploaded":"2022-01-11 09:21:17","revisionof":"","revisedto":"R2-2201819","release":"Rel-17","crspec":38.34,"crspecversion":"16.5.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201303.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201304","title":"Running CR of TS 38.340 for eIAB Option2","source":"Huawei, HiSilicon","contact":"Yulong Shi","contact-id":78274,"tdoctype":"draftCR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":13040,"status":"available","reservation_date":"2022-01-11 02:22:53","uploaded":"2022-01-11 09:21:17","revisionof":"","revisedto":"","release":"Rel-17","crspec":38.34,"crspecversion":"16.5.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201304.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201527","title":"Running CR to 38.321 on Integrated Access and Backhaul for NR Rel-17","source":"Samsung Electronics GmbH","contact":"Milos Tesanovic","contact-id":66723,"tdoctype":"CR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":15270,"status":"revised","reservation_date":"2022-01-11 09:06:19","uploaded":"2022-01-11 10:14:41","revisionof":"R2-2110453","revisedto":"R2-2201850","release":"Rel-17","crspec":38.321,"crspecversion":"16.7.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":1171.0,"crrevision":1.0,"crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201527.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201613","title":"Running CR to 38.331 on NR IAB enhancements","source":"Ericsson","contact":"Marco Belleschi","contact-id":61839,"tdoctype":"CR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":16130,"status":"revised","reservation_date":"2022-01-11 10:54:04","uploaded":"2022-01-11 11:13:17","revisionof":"R2-2111604","revisedto":"R2-2201993","release":"Rel-17","crspec":38.331,"crspecversion":"16.7.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":2811.0,"crrevision":2.0,"crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201613.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201819","title":"Running CR of TS 38.340 for eIAB","source":"Huawei, HiSilicon","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"draftCR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":13031,"status":"noted","reservation_date":"2022-01-28 13:44:45","uploaded":"2022-01-28 13:44:45","revisionof":"R2-2201303","revisedto":"","release":"Rel-17","crspec":38.34,"crspecversion":"16.5.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201819.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201850","title":"Running CR to 38.321 on Integrated Access and Backhaul for NR Rel-17","source":"Samsung Electronics GmbH","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"CR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":15271,"status":"revised","reservation_date":"2022-01-20 18:53:44","uploaded":"2022-01-20 18:53:44","revisionof":"R2-2201527","revisedto":"R2-2201984","release":"Rel-17","crspec":38.321,"crspecversion":"16.7.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":1171.0,"crrevision":2.0,"crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201850.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201984","title":"Running CR to 38.321 on Integrated Access and Backhaul for NR Rel-17","source":"Samsung Electronics GmbH","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"CR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":15272,"status":"noted","reservation_date":"2022-01-28 13:44:46","uploaded":"2022-01-28 13:44:46","revisionof":"R2-2201850","revisedto":"R2-2203276","release":"Rel-17","crspec":38.321,"crspecversion":"16.7.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":1171.0,"crrevision":3.0,"crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201984.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2201993","title":"Running CR to 38.331 on NR IAB enhancements","source":"Ericsson","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"CR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":16131,"status":"noted","reservation_date":"2022-01-28 13:44:46","uploaded":"2022-01-28 13:44:46","revisionof":"R2-2201613","revisedto":"R2-2203471","release":"Rel-17","crspec":38.331,"crspecversion":"16.7.0","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":2811.0,"crrevision":3.0,"crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2201993.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2202050","title":"[Post116bis-e][079][eIAB] Open Issues (Qualcomm)","source":"Qualcomm (Rapporteur)","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":46,"ainumber":"8.4.1","ainame":"Organizational","tdoc_agenda_sort_order":205000,"status":"noted","reservation_date":"2022-01-31 12:39:04","uploaded":"2022-01-31 12:39:04","revisionof":"","revisedto":"","release":"Rel-17","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IAB_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_116bis-e\/Docs\/R2-2202050.zip","group":"R2","meeting":"R2-116-bis-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]