[{"name":"R4-2312050","title":"Discussion on MSR BS EMC test simplification","source":"ZTE Corporation","contact":"Xiangwei Jing","contact-id":93905,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-11-08 06:48:44","uploaded":"2023-08-11 08:49:37","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2312050.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2312290","title":"BS EMC enhancements","source":"Nokia, Nokia Shanghai Bell","contact":"Veli-Matti Holappa","contact-id":99921,"tdoctype":"other","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-11-08 08:07:58","uploaded":"2023-08-11 19:21:34","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LTE_EMC_enh"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2312290.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2312912","title":"Discussion on BS EMC enhancement","source":"Ericsson","contact":"Bing Li","contact-id":95904,"tdoctype":"other","for":"Approval","abstract":"Analysis of the potential gain of BS EMC enhancement and solution of EMC enhancement for Multi-band MSR","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-11-08 11:16:25","uploaded":"2023-08-11 11:28:06","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2312912.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2312913","title":"CR to TS 37.113 Implementation of EMC enhancements","source":"Ericsson","contact":"Bing Li","contact-id":95904,"tdoctype":"CR","for":"Agreement","abstract":"Implementation of the proposed RATs reduction for both single-band and multi-band MSR","secretary_remarks":"Source modified on 8\/11\/2023. Original source : Ericsson","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"not pursued","reservation_date":"2023-11-08 11:16:25","uploaded":"2023-08-11 11:28:06","revisionof":"","revisedto":"","release":"Rel-18","crspec":"37.113","crspecversion":"17.2.0","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":127.0,"crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2312913.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":false,"me_affected":false,"ran_affected":true,"cn_affected":false,"clauses_affected":"4.5, A.3","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313607","title":"Analysis of the manufacturer declarations implementation in legacy BS EMC specifications","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"discussion","for":"Discussion","abstract":"In this contribution we provide preparatory work for new EMC-specific declaration introduction, with the analysis of the legacy EMC BS specifications and the way manufacturer declarations were used there.","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-11-08 16:46:36","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313607.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313608","title":"CR to TS 37.113: framework for the EMC-specific manufacturer's declarations, Rel-18","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"CR","for":"Agreement","abstract":"In order to properly implement EMC test reduction solution for MSR BS (i.e. new manufacturer declaration), it was identified that multiple issues related to the EMC-specific manufacturer declarations are required to be fixed first, including introduction of new section for the definition of EMC-specific manufacturer declarations.","secretary_remarks":"Source modified on 8\/11\/2023. Original source : Huawei, HiSilicon","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"not pursued","reservation_date":"2023-11-08 16:46:36","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"","release":"Rel-18","crspec":"37.113","crspecversion":"17.2.0","workitem":[{"winame":"TEI18"},{"winame":" NR_LTE_EMC_enh-Perf"}],"crnumber":128.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313608.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":false,"me_affected":false,"ran_affected":true,"cn_affected":false,"clauses_affected":"1, 4.6, 6.2, 6.3, 6.4, 9.4, 9.5","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313609","title":"CR to TS 37.114: framework for the EMC-specific manufacturer's declarations, Rel-18","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"CR","for":"Agreement","abstract":"In order to properly implement EMC test reduction solution for AAS BS (i.e. new manufacturer declaration), it was identified that multiple issues related to the EMC-specific manufacturer declarations are required to be fixed first, including introduction of new section for the definition of EMC-specific manufacturer declarations.","secretary_remarks":"Source modified on 8\/11\/2023. Original source : Huawei, HiSilicon","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"not pursued","reservation_date":"2023-11-08 16:46:37","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"","release":"Rel-18","crspec":"37.114","crspecversion":"17.1.0","workitem":[{"winame":"TEI18"},{"winame":" NR_LTE_EMC_enh-Perf"}],"crnumber":107.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313609.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":false,"me_affected":false,"ran_affected":true,"cn_affected":false,"clauses_affected":"1, 3.1, 4, 4.4, 4.5, 9.4, 9.5","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313610","title":"CR to TS 38.113: framework for the EMC-specific manufacturer's declarations, Rel-18","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"CR","for":"Agreement","abstract":"In order to align all BS EMC specifications, this CR mirrors modifications from TS 37.113 and TS 37.114, introducing new section for the definition of EMC-specific manufacturer declarations.","secretary_remarks":"Source modified on 8\/11\/2023. Original source : Huawei, HiSilicon","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-11-08 16:46:37","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"R4-2313995","release":"Rel-18","crspec":"38.113","crspecversion":"17.4.0","workitem":[{"winame":"TEI18"},{"winame":" NR_LTE_EMC_enh-Perf"}],"crnumber":64.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313610.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":false,"me_affected":false,"ran_affected":true,"cn_affected":false,"clauses_affected":"1, 4.5, 4.6, 6.2, 6.3, 6.4, 9.4, 9.5","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313611","title":"CR to TS 36.113: framework for the EMC-specific manufacturer's declarations, Rel-18","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"CR","for":"Agreement","abstract":"In order to align all BS EMC specifications, this CR mirrors modifications from TS 37.113 and TS 37.114, introducing new section for the definition of EMC-specific manufacturer declarations.","secretary_remarks":"Source modified on 8\/11\/2023. Original source : Huawei, HiSilicon","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-11-08 16:46:38","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"R4-2313913","release":"Rel-18","crspec":"36.113","crspecversion":"17.1.0","workitem":[{"winame":"TEI18"},{"winame":" NR_LTE_EMC_enh-Perf"}],"crnumber":88.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313611.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":false,"me_affected":false,"ran_affected":true,"cn_affected":false,"clauses_affected":"1, 4.7, 6.3, 6.4, 6.6, 9.4, 9.5","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313612","title":"Further discussion on EMC requirements simplification for MSR BS and AAS BS","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"discussion","for":"Discussion","abstract":"In this contribution we provide further analysis and proposals related to the implementation of the MSR BS and AAS BS testing simplifications for EMC requirements.","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-11-08 16:46:39","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313612.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313614","title":"draft CR to TS 37.113: example implementation of the MSR BS testing simplification","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"draftCR","for":"Endorsement","abstract":"Based on related discussion, an early draft CR was generated to initiate discussion on the implementation aspects, and to visualize the expected implementation into TS 37.113.","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"not pursued","reservation_date":"2023-11-08 16:46:39","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"","release":"Rel-18","crspec":"37.113","crspecversion":"17.2.0","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313614.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313615","title":"draft CR to TS 37.114: example implementation of the AAS BS testing simplification","source":"Huawei, HiSilicon","contact":"Michal Szydelko","contact-id":65553,"tdoctype":"draftCR","for":"Endorsement","abstract":"Based on related discussion, an early draft CR was generated to initiate discussion on the implementation aspects, and to visualize the expected implementation into TS 37.114.","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"revised","reservation_date":"2023-11-08 16:46:39","uploaded":"2023-08-11 18:59:34","revisionof":"","revisedto":"R4-2313915","release":"Rel-18","crspec":"37.114","crspecversion":"17.1.0","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313615.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313913","title":"CR to TS 36.113: framework for the EMC-specific manufacturer's declarations, Rel-18","source":"Huawei, HiSilicon","contact":"Achraf Khsiba","contact-id":92474,"tdoctype":"CR","for":"Endorsement","abstract":"Session Chair: This is a formal CR for endorsement","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"endorsed","reservation_date":"2023-08-14 10:31:26","uploaded":"2023-08-25 12:51:09","revisionof":"R4-2313611","revisedto":"","release":"Rel-18","crspec":"36.113","crspecversion":"17.1.0","workitem":[{"winame":"TEI18"},{"winame":" NR_LTE_EMC_enh-Perf"}],"crnumber":88.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313913.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313915","title":"draft CR to TS 37.114: example implementation of the AAS BS testing simplification","source":"Huawei, HiSilicon","contact":"Achraf Khsiba","contact-id":92474,"tdoctype":"draftCR","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"postponed","reservation_date":"2023-08-14 10:31:26","uploaded":"2023-08-25 12:51:09","revisionof":"R4-2313615","revisedto":"","release":"Rel-18","crspec":"37.114","crspecversion":"17.1.0","workitem":[{"winame":"NR_LTE_EMC_enh-Perf"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313915.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2313995","title":"CR to TS 38.113: framework for the EMC-specific manufacturer's declarations, Rel-18","source":"Huawei, HiSilicon","contact":"Achraf Khsiba","contact-id":92474,"tdoctype":"CR","for":"Endorsement","abstract":"Session Chair: This is a formal CR for endorsement","secretary_remarks":"","agenda_item_sort_order":365,"ainumber":"8.17.2","ainame":"BS EMC enhancements","tdoc_agenda_sort_order":0,"status":"endorsed","reservation_date":"2023-08-14 10:31:28","uploaded":"2023-08-25 12:51:10","revisionof":"R4-2313610","revisedto":"","release":"Rel-18","crspec":"38.113","crspecversion":"17.4.0","workitem":[{"winame":"TEI18"},{"winame":" NR_LTE_EMC_enh-Perf"}],"crnumber":64.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108\/Docs\/R4-2313995.zip","group":"R4","meeting":"R4-108","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]