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{"name":"R2-2300523","title":"IDC configuration and report in MR-DC","source":"Ericsson","contact":"Min Wang","contact-id":88470,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":5230,"status":"available","reservation_date":"2023-02-15 13:51:35","uploaded":"2023-02-16 15:14:23","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2300523.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2300543","title":"FDM Solutions in IDC","source":"Qualcomm Incorporated","contact":"Sherif ElAzzouni","contact-id":88670,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":5430,"status":"available","reservation_date":"2023-02-15 17:39:52","uploaded":"2023-02-17 00:02:42","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2300543.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2300743","title":"Discussion on detailed FDM solutions in IDC","source":"Apple","contact":"Naveen Palle","contact-id":102928,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":7430,"status":"available","reservation_date":"2023-02-16 02:52:33","uploaded":"2023-02-17 04:52:19","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2300743.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2300831","title":"Enhanced FDM solution for IDC","source":"Intel Corporation","contact":"Youn hyoung Heo","contact-id":47007,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":8310,"status":"available","reservation_date":"2023-02-16 05:50:40","uploaded":"2023-02-17 06:12:01","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2300831.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2300874","title":"FDM solutions","source":"Nokia, Nokia Shanghai Bell","contact":"Jarkko Koskela","contact-id":69947,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":8740,"status":"available","reservation_date":"2023-02-16 06:54:05","uploaded":"2023-02-17 07:07:35","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2300874.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2300968","title":"FDM solution for IDC","source":"Lenovo","contact":"Lianhai Wu","contact-id":70742,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":9680,"status":"available","reservation_date":"2023-02-16 08:27:24","uploaded":"2023-02-17 03:33:20","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2300968.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301108","title":"Remaining issues for FDM and MRDC coordination","source":"Xiaomi","contact":"Yumin Wu","contact-id":90494,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":11080,"status":"available","reservation_date":"2023-02-16 10:53:32","uploaded":"2023-02-17 07:29:58","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301108.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301326","title":"Discussion on FDM solution for IDC","source":"Samsung","contact":"Weiwei Wang","contact-id":72273,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":13260,"status":"available","reservation_date":"2023-02-16 14:09:13","uploaded":"2023-02-17 03:52:58","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301326.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301486","title":"Summary of [Post120][652][IDC] Further details of FDM solution (Huawei)","source":"Huawei, HiSilicon","contact":"Jagdeep Singh","contact-id":90399,"tdoctype":"discussion","for":"Decision","abstract":"=> Offline#652 (Huawei)","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":14860,"status":"noted","reservation_date":"2023-02-16 22:34:22","uploaded":"2023-02-17 03:13:36","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301486.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301487","title":"Further discussion on details of FDM enhancement for NR IDC","source":"Huawei, HiSilicon","contact":"Jagdeep Singh","contact-id":90399,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":14870,"status":"available","reservation_date":"2023-02-16 22:34:22","uploaded":"2023-02-17 03:13:36","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301487.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301598","title":"Discussion on FDM solution for R18 IDC","source":"vivo","contact":"Yanxia Zhang","contact-id":77052,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":15980,"status":"available","reservation_date":"2023-02-17 01:35:15","uploaded":"2023-02-17 06:09:12","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301598.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301706","title":"Further Consideration on the IDC FDM Solutions","source":"ZTE Corporation, Sanechips","contact":"Wenting Li","contact-id":78193,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":17060,"status":"available","reservation_date":"2023-02-17 04:04:22","uploaded":"2023-02-17 06:02:49","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301706.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2301799","title":"Discussion on IDC FDM solution enhancement","source":"CATT","contact":"Haocheng Wang","contact-id":93050,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":17990,"status":"available","reservation_date":"2023-02-17 06:03:37","uploaded":"2023-02-17 08:48:56","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2301799.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2302071","title":"[AT121][652][IDC]  Discussion on FDM solution(Huawei)","source":"Huawei","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"discussion","for":"Decision","abstract":"=> To Email [Post121][655][IDC] Discussion on Leftover issues for IDC (Xiaomi).","secretary_remarks":"","agenda_item_sort_order":160,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":229800,"status":"noted","reservation_date":"2023-03-03 13:38:24","uploaded":"2023-03-03 13:38:24","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_121\/Docs\/R2-2302071.zip","group":"R2","meeting":"R2-121","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]