[{"name":"R2-2211581","title":"FDM Solutions in IDC","source":"Qualcomm Incorporated","contact":"Sherif ElAzzouni","contact-id":88670,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":15810,"status":"available","reservation_date":"2022-11-03 00:09:51","uploaded":"2022-11-03 22:56:41","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211581.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2211608","title":"Discussion on FDM enhancement","source":"Huawei, HiSilicon","contact":"Jagdeep Singh","contact-id":90399,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":16080,"status":"available","reservation_date":"2022-11-03 00:45:13","uploaded":"2022-11-04 08:10:50","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211608.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2211618","title":"Enhanced FDM solution for IDC","source":"Intel Corporation","contact":"Youn hyoung Heo","contact-id":47007,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":16180,"status":"available","reservation_date":"2022-11-03 01:29:56","uploaded":"2022-11-04 05:30:13","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211618.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2211740","title":"Discussion on FDM solutions in IDC","source":"Apple","contact":"Naveen Palle","contact-id":88329,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":17400,"status":"noted","reservation_date":"2022-11-03 03:12:35","uploaded":"2022-11-04 03:15:03","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211740.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2211756","title":"Discussion on FDM solution enhancements for IDC","source":"OPPO","contact":"Xinlei Yu","contact-id":88869,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":17560,"status":"available","reservation_date":"2022-11-03 03:20:50","uploaded":"2022-11-04 07:42:02","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211756.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2211969","title":"FDM solutions","source":"Nokia, Nokia Shanghai Bell","contact":"Jarkko Koskela","contact-id":69947,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":19690,"status":"available","reservation_date":"2022-11-03 09:55:38","uploaded":"2022-11-04 08:02:28","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211969.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2211979","title":"Discussion on the FDM Option 1 and 2","source":"Xiaomi","contact":"Yumin Wu","contact-id":90494,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":19790,"status":"available","reservation_date":"2022-11-03 10:28:12","uploaded":"2022-11-04 08:03:06","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2211979.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212412","title":"More granular FDM indications","source":"Ericsson","contact":"Mattias Bergstrom","contact-id":46046,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":24120,"status":"available","reservation_date":"2022-11-03 21:16:02","uploaded":"2022-11-03 22:07:39","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212412.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212420","title":"Report from [Post119-e][650][IDC] Comparison of FDM solutions (Ericsson)","source":"Ericsson","contact":"Mattias Bergstrom","contact-id":46046,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":24200,"status":"noted","reservation_date":"2022-11-03 21:16:07","uploaded":"2022-11-03 22:07:39","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212420.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212652","title":"Discussion on FDM solution for R18 IDC","source":"vivo","contact":"Yanxia Zhang","contact-id":77052,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":26520,"status":"available","reservation_date":"2022-11-04 01:57:01","uploaded":"2022-11-04 07:13:22","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212652.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212668","title":"Discussion on FDM solution enhancements","source":"Sharp","contact":"Lei Liu","contact-id":89429,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":26680,"status":"available","reservation_date":"2022-11-04 02:12:46","uploaded":"2022-11-04 06:35:28","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212668.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212743","title":"Further Consideration on the IDC FDM Solutions","source":"ZTE Corporation, Sanechips","contact":"Wenting Li","contact-id":78193,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":27430,"status":"available","reservation_date":"2022-11-04 03:29:45","uploaded":"2022-11-04 08:51:43","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212743.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212816","title":"Discussion on FDM solution for IDC","source":"Samsung","contact":"Weiwei Wang","contact-id":72273,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":28160,"status":"available","reservation_date":"2022-11-04 06:21:32","uploaded":"2022-11-04 08:26:57","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212816.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212921","title":"IDC FDM solution","source":"LG Electronics","contact":"SungHoon Jung","contact-id":45636,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":29210,"status":"available","reservation_date":"2022-11-04 08:18:11","uploaded":"2022-11-04 08:56:12","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212921.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2212931","title":"FDM solution for IDC","source":"Lenovo","contact":"Lianhai Wu","contact-id":70742,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":216,"ainumber":"8.10.2","ainame":"FDM solution enhancements","tdoc_agenda_sort_order":29310,"status":"available","reservation_date":"2022-11-04 08:34:32","uploaded":"2022-11-04 08:43:27","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_120\/Docs\/R2-2212931.zip","group":"R2","meeting":"R2-120","year":2022,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]