[{"name":"R2-2403139","title":"UE capabilities on MP relay","source":"Qualcomm Incorporated","contact":"Jianhua Liu","contact-id":101897,"tdoctype":"discussion","for":"Approval","abstract":"This contribution discusses the issues on MP relay.\n=> Offline#403 (Qualcomm)","secretary_remarks":"","agenda_item_sort_order":108,"ainumber":"7.9.7","ainame":"UE capabilities","tdoc_agenda_sort_order":31390,"status":"noted","reservation_date":"2024-04-04 13:56:17","uploaded":"2024-04-05 05:54:40","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_125bis\/Docs\/R2-2403139.zip","group":"R2","meeting":"R2-125-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2403312","title":"UE capability corrections for multi-path operation","source":"Huawei, HiSilicon","contact":"Jagdeep Singh","contact-id":90399,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":108,"ainumber":"7.9.7","ainame":"UE capabilities","tdoc_agenda_sort_order":33120,"status":"available","reservation_date":"2024-04-04 21:06:52","uploaded":"2024-04-05 06:31:20","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_125bis\/Docs\/R2-2403312.zip","group":"R2","meeting":"R2-125-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2403370","title":"Remaining Open Issues in 38.306","source":"Ericsson","contact":"Nithin Srinivasan","contact-id":93935,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":108,"ainumber":"7.9.7","ainame":"UE capabilities","tdoc_agenda_sort_order":33700,"status":"noted","reservation_date":"2024-04-05 00:10:46","uploaded":"2024-04-05 07:11:49","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_125bis\/Docs\/R2-2403370.zip","group":"R2","meeting":"R2-125-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2403803","title":"UE capability for simultaneous transmission on split bearer (Qualcomm)","source":"Qualcomm Incorporated","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":108,"ainumber":"7.9.7","ainame":"UE capabilities","tdoc_agenda_sort_order":395900,"status":"noted","reservation_date":"2024-04-18 06:40:51","uploaded":"2024-04-18 06:40:51","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_SL_relay_enh-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_125bis\/Docs\/R2-2403803.zip","group":"R2","meeting":"R2-125-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]