[{"name":"R1-162361","title":"Enhancements of sidelink physical layer structure for PC5 V2V communication","source":"Intel Corporation","contact":"Seunghee Han","contact-id":47329,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":57,"ainumber":"7.3.2.1.3","ainame":"Other","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-29 20:11:20","uploaded":"2016-04-02 06:11:46","revisionof":"","revisedto":"","release":"Rel-14","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_84b\/Docs\/R1-162361.zip","group":"R1","meeting":"R1-84","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-162825","title":"L1 Format for V2V Transmissions using Sidelink","source":"Ericsson LM","contact":"Stefano Sorrentino","contact-id":44504,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":57,"ainumber":"7.3.2.1.3","ainame":"Other","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-31 11:08:30","uploaded":"2016-04-01 16:37:02","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_84b\/Docs\/R1-162825.zip","group":"R1","meeting":"R1-84","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]