[{"name":"R1-162125","title":"Introduction of larger max TBS for TDD UL for eMTC in TS36.212","source":"Huawei, HiSilicon, CATR, CATT, CMCC, Potevio, Spreadtrum, Xinwei","contact":"Brian Classon","contact-id":45750,"tdoctype":"draftCR","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":115,"ainumber":"7.3.11","ainame":"Other","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-03-20 23:32:07","uploaded":"2016-04-01 23:09:33","revisionof":"","revisedto":"","release":"","crspec":36.212,"crspecversion":"13.1.0","workitem":[{"winame":"TEI14"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_84b\/Docs\/R1-162125.zip","group":"R1","meeting":"R1-84","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-162126","title":"Introduction of larger max TBS for TDD UL for eMTC in TS36.213","source":"Huawei, HiSilicon, CATR, CATT, CMCC, Potevio, Spreadtrum, Xinwei","contact":"Brian Classon","contact-id":45750,"tdoctype":"draftCR","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":115,"ainumber":"7.3.11","ainame":"Other","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-03-20 23:32:08","uploaded":"2016-04-01 23:09:33","revisionof":"","revisedto":"","release":"","crspec":36.213,"crspecversion":"13.1.1","workitem":[{"winame":"TEI14"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_84b\/Docs\/R1-162126.zip","group":"R1","meeting":"R1-84","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-162136","title":"Introduction of larger max TBS for TDD UL for eMTC in TS36.306","source":"Huawei, HiSilicon, CATR, CATT, CMCC, Potevio, Spreadtrum, Xinwei","contact":"Brian Classon","contact-id":45750,"tdoctype":"draftCR","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":115,"ainumber":"7.3.11","ainame":"Other","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-03-20 23:32:08","uploaded":"2016-04-01 23:09:33","revisionof":"","revisedto":"","release":"","crspec":36.306,"crspecversion":"13.1.0","workitem":[{"winame":"TEI14"}],"crnumber":"","crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_84b\/Docs\/R1-162136.zip","group":"R1","meeting":"R1-84","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-162378","title":"Work plan for FeCoMP study item","source":"Intel Corporation","contact":"Seunghee Han","contact-id":47329,"tdoctype":"discussion","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":115,"ainumber":"7.3.11","ainame":"Other","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-29 20:11:20","uploaded":"2016-04-02 06:13:07","revisionof":"","revisedto":"","release":"Rel-14","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_84b\/Docs\/R1-162378.zip","group":"R1","meeting":"R1-84","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]