[{"name":"R2-2407905","title":"Reply LS on Mitigation of Downgrade attacks (C1-245048; contact: vivo)","source":"CT1","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"LS in","for":"Information","abstract":"","secretary_remarks":"","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":79050,"status":"noted","reservation_date":"2024-09-29 21:25:26","uploaded":"2024-09-29 21:45:46","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"TEI18"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"S3-242367","lsto":"SA3","Cc":"RAN2","lsoriginalls":"C1-245048","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2407905.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2407971","title":"Discussion on LS R4-2410693","source":"OPPO","contact":"Qianxi Lu","contact-id":71851,"tdoctype":"discussion","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":79710,"status":"noted","reservation_date":"2024-09-30 01:04:12","uploaded":"2024-10-04 01:04:07","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"TEI18"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2407971.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2408401","title":"Consideration on the  intra-band EN-DC Channel Spacing","source":"ZTE Corporation","contact":"Wenting Li","contact-id":78193,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":84010,"status":"noted","reservation_date":"2024-10-01 22:53:24","uploaded":"2024-10-03 20:13:16","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"TEI18"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2408401.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2408473","title":"Discussion on intra-band EN-DC channel spacing","source":"Huawei, HiSilicon","contact":"Tong Sha","contact-id":91943,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":84730,"status":"noted","reservation_date":"2024-10-02 09:47:00","uploaded":"2024-10-04 07:19:20","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"TEI18"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2408473.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2408474","title":"Introduction of new capability for intra-band EN-DC channel spacing [Intra-Band_EN-DC_Channelspacing]","source":"Huawei, HiSilicon","contact":"Tong Sha","contact-id":91943,"tdoctype":"CR","for":"Agreement","abstract":"=> Offline#010 (Huawei)\n=> Agreed in principle","secretary_remarks":"Source modified on 10\/4\/2024. Original source : Huawei, HiSilicon","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":84740,"status":"endorsed","reservation_date":"2024-10-02 09:47:00","uploaded":"2024-10-04 07:19:20","revisionof":"","revisedto":"R2-2410833","release":"Rel-18","crspec":38.331,"crspecversion":"18.3.0","workitem":[{"winame":"TEI18"}],"crnumber":5013.0,"crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2408474.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":false,"me_affected":true,"ran_affected":true,"cn_affected":false,"clauses_affected":"6.3.3","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2408475","title":"Introduction of new capability for intra-band EN-DC channel spacing [Intra-Band_EN-DC_Channelspacing]","source":"Huawei, HiSilicon","contact":"Tong Sha","contact-id":91943,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"Source modified on 10\/4\/2024. Original source : Huawei, HiSilicon","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":84750,"status":"revised","reservation_date":"2024-10-02 09:47:00","uploaded":"2024-10-04 07:19:20","revisionof":"","revisedto":"R2-2409399","release":"Rel-18","crspec":38.306,"crspecversion":"18.3.0","workitem":[{"winame":"TEI18"}],"crnumber":1174.0,"crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2408475.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":false,"me_affected":true,"ran_affected":true,"cn_affected":false,"clauses_affected":"4.2.7.9","crsinpack":null,"crsinpacknumber":0},
{"name":"R2-2409399","title":"Introduction of new capability for intra-band EN-DC channel spacing [Intra-Band_EN-DC_Channelspacing]","source":"Huawei, HiSilicon","contact":"Juha Korhonen","contact-id":21609,"tdoctype":"CR","for":"Agreement","abstract":"=> Agreed in principle","secretary_remarks":"","agenda_item_sort_order":113,"ainumber":"7.24.1","ainame":"TEI proposals by Other Groups","tdoc_agenda_sort_order":84751,"status":"endorsed","reservation_date":"2024-10-17 06:36:19","uploaded":"2024-10-17 06:36:19","revisionof":"R2-2408475","revisedto":"R2-2410834","release":"Rel-18","crspec":38.306,"crspecversion":"18.3.0","workitem":[{"winame":"TEI18"}],"crnumber":1174.0,"crrevision":1.0,"crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2409399.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]