[{"name":"R1-1904831","title":"Work Plan for NR Industrial IoT WI","source":"Nokia","contact":"Sigen Ye","contact-id":45768,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":92,"ainumber":"7.2.6","ainame":"Physical Layer Enhancements for NR URLLC","tdoc_agenda_sort_order":48310,"status":"noted","reservation_date":"2019-03-28 22:18:36","uploaded":"2019-04-03 01:39:30","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_96b\/Docs\/R1-1904831.zip","group":"R1","meeting":"R1-96","year":2019,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1905455","title":"Work plan for Rel-16 WI on physical layer enhancements for URLLC","source":"Huawei, HiSilicon","contact":"Brian Classon","contact-id":45750,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":92,"ainumber":"7.2.6","ainame":"Physical Layer Enhancements for NR URLLC","tdoc_agenda_sort_order":54550,"status":"noted","reservation_date":"2019-04-02 12:27:38","uploaded":"2019-04-02 20:21:49","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_96b\/Docs\/R1-1905455.zip","group":"R1","meeting":"R1-96","year":2019,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]