[{"name":"R1-1705093","title":"High-level design principle for feCoMP","source":"SoftBank Corp.","contact":"Yosuke Akimoto","contact-id":59235,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":69,"ainumber":"7.2.4","ainame":"Further enhancements to CoMP Operation for LTE - WID in RP-170750","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2017-03-23 05:41:39","uploaded":"2017-03-24 06:05:19","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_88b\/Docs\/R1-1705093.zip","group":"R1","meeting":"R1-88","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1706244","title":"WF on FeCoMP enhancements for NCJT","source":"ZTE, ZTE Microelectronics, Intel, Qualcomm, ASTRI","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":69,"ainumber":"7.2.4","ainame":"Further enhancements to CoMP Operation for LTE - WID in RP-170750","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2017-04-04 06:50:04","uploaded":"2017-04-09 09:37:26","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_88b\/Docs\/R1-1706244.zip","group":"R1","meeting":"R1-88","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1706245","title":"WF on the number of DCIs for NCJT FeCoMP","source":"Intel, ZTE, ZTE Microelectronics, ASTRI, Qualcomm, SoftBank, Huawei, HiSilicon","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":69,"ainumber":"7.2.4","ainame":"Further enhancements to CoMP Operation for LTE - WID in RP-170750","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2017-04-04 06:50:04","uploaded":"2017-04-09 09:37:26","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_88b\/Docs\/R1-1706245.zip","group":"R1","meeting":"R1-88","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1706247","title":"void","source":"ETSI","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":69,"ainumber":"7.2.4","ainame":"Further enhancements to CoMP Operation for LTE - WID in RP-170750","tdoc_agenda_sort_order":0,"status":"withdrawn","reservation_date":"2017-04-04 06:50:04","uploaded":null,"revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"","group":"R1","meeting":"R1-88","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1706248","title":"void","source":"ETSI","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":69,"ainumber":"7.2.4","ainame":"Further enhancements to CoMP Operation for LTE - WID in RP-170750","tdoc_agenda_sort_order":0,"status":"withdrawn","reservation_date":"2017-04-04 06:50:04","uploaded":null,"revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"","group":"R1","meeting":"R1-88","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1706790","title":"Chairman's notes of AI 7.2.4 Further enhancements to Coordinated Multi-Point Operation","source":"Ad-Hoc chair (ZTE)","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"Endorsement","abstract":"","secretary_remarks":"","agenda_item_sort_order":69,"ainumber":"7.2.4","ainame":"Further enhancements to CoMP Operation for LTE - WID in RP-170750","tdoc_agenda_sort_order":0,"status":"endorsed","reservation_date":"2017-04-25 16:19:23","uploaded":"2017-04-25 16:27:52","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_88b\/Docs\/R1-1706790.zip","group":"R1","meeting":"R1-88","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]