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{"name":"R2-2408937","title":"Correction on the idc-TDM-AssistanceConfig","source":"Huawei, HiSilicon, Xiaomi, Nokia, Intel Corporation, Ericsson, Apple, Samsung","contact":"Jagdeep Singh","contact-id":90399,"tdoctype":"CR","for":"Agreement","abstract":"=> Agreed in principle","secretary_remarks":"Source modified on 10\/4\/2024. Original source : Huawei, HiSilicon, Xiaomi, Nokia, Intel Corporation, Ericsson, Apple, Samsung","agenda_item_sort_order":47,"ainumber":"7.0.2.5","ainame":"IDC enhancements for NR and MR-DC","tdoc_agenda_sort_order":89370,"status":"endorsed","reservation_date":"2024-10-03 20:44:31","uploaded":"2024-10-04 08:06:33","revisionof":"","revisedto":"R2-2410585","release":"Rel-18","crspec":38.331,"crspecversion":"18.3.0","workitem":[{"winame":"NR_IDC_enh-Core"}],"crnumber":5062.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_127bis\/Docs\/R2-2408937.zip","group":"R2","meeting":"R2-127-bis","year":2024,"uicc_affected":false,"me_affected":true,"ran_affected":true,"cn_affected":false,"clauses_affected":"6.3.4","crsinpack":null,"crsinpacknumber":0}]