[{"name":"R5-186452","title":"Corrections to IMS test case G.17.2","source":"ROHDE & SCHWARZ","contact":"Hans Rohnert","contact-id":50081,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":485,"ainumber":"6.5.6.1","ainame":"\tTS 34.229-1","tdoc_agenda_sort_order":64520,"status":"withdrawn","reservation_date":"2018-10-19 08:05:29","uploaded":"2018-11-02 14:34:16","revisionof":"","revisedto":"","release":"Rel-14","crspec":"34.229-1","crspecversion":"14.4.0","workitem":[{"winame":"TEI11_Test"},{"winame":"MTSI_WLAN-UEConTest"}],"crnumber":1296.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/WG5_Test_ex-T1\/TSGR5_81_Spokane\/Docs\/R5-186452.zip","group":"R5","meeting":"R5-81","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R5-186456","title":"Corrections to C.32 and C.32a","source":"ROHDE & SCHWARZ, Qualcomm Incorporated","contact":"Hans Rohnert","contact-id":50081,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":485,"ainumber":"6.5.6.1","ainame":"\tTS 34.229-1","tdoc_agenda_sort_order":64560,"status":"revised","reservation_date":"2018-10-19 13:00:39","uploaded":"2018-11-02 14:34:16","revisionof":"","revisedto":"","release":"Rel-14","crspec":"34.229-1","crspecversion":"14.4.0","workitem":[{"winame":"TEI9_Test"}],"crnumber":1297.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/WG5_Test_ex-T1\/TSGR5_81_Spokane\/Docs\/R5-186456.zip","group":"R5","meeting":"R5-81","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R5-186459","title":"Corrections to IMS test case 15.25","source":"Rohde & Schwarz, Intel, Qualcomm Incorporated","contact":"Ingbert Sigovich","contact-id":28887,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":485,"ainumber":"6.5.6.1","ainame":"\tTS 34.229-1","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2018-10-19 15:59:34","uploaded":"2018-11-02 14:34:16","revisionof":"","revisedto":"","release":"Rel-14","crspec":"34.229-1","crspecversion":"14.4.0","workitem":[{"winame":"TEI8_Test"}],"crnumber":1298.0,"crrevision":"","crcategory":"F","tsg_crp":"RP-182283","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/WG5_Test_ex-T1\/TSGR5_81_Spokane\/Docs\/R5-186459.zip","group":"R5","meeting":"R5-81","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R5-187374","title":"Correction to Contact header in MT INVITE","source":"ROHDE & SCHWARZ, Qualcomm Incorporated","contact":"Ingbert Sigovich","contact-id":28887,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":485,"ainumber":"6.5.6.1","ainame":"\tTS 34.229-1","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2018-11-02 09:28:57","uploaded":"2018-11-02 14:34:16","revisionof":"","revisedto":"","release":"Rel-14","crspec":"34.229-1","crspecversion":"14.4.0","workitem":[{"winame":"TEI8_Test"}],"crnumber":1299.0,"crrevision":"","crcategory":"F","tsg_crp":"RP-182283","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/WG5_Test_ex-T1\/TSGR5_81_Spokane\/Docs\/R5-187374.zip","group":"R5","meeting":"R5-81","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R5-187567","title":"Corrections to IMS WLAN test case G.17.2","source":"Qualcomm Incorporated","contact":"Ingbert Sigovich","contact-id":28887,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":485,"ainumber":"6.5.6.1","ainame":"\tTS 34.229-1","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2018-11-02 20:18:30","uploaded":"2018-11-21 06:17:53","revisionof":"","revisedto":"","release":"Rel-14","crspec":"34.229-1","crspecversion":"14.4.0","workitem":[{"winame":"TEI11_Test"},{"winame":"MTSI_WLAN-UEConTest"}],"crnumber":1300.0,"crrevision":"","crcategory":"F","tsg_crp":"RP-182286","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/WG5_Test_ex-T1\/TSGR5_81_Spokane\/Docs\/R5-187567.zip","group":"R5","meeting":"R5-81","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R5-187683","title":"Corrections to C.32 and C.32a","source":"ROHDE & SCHWARZ, Qualcomm Incorporated","contact":"Ingbert Sigovich","contact-id":28887,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":485,"ainumber":"6.5.6.1","ainame":"\tTS 34.229-1","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2018-11-20 12:18:52","uploaded":"2018-11-21 06:17:54","revisionof":"","revisedto":"","release":"Rel-14","crspec":"34.229-1","crspecversion":"14.4.0","workitem":[{"winame":"TEI9_Test"}],"crnumber":1297.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"RP-182284","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/WG5_Test_ex-T1\/TSGR5_81_Spokane\/Docs\/R5-187683.zip","group":"R5","meeting":"R5-81","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]