[{"name":"R5-151689","title":"Void 1x SRVCC test case 8.4.7.1","source":"Qualcomm Incorporated","contact":"Ankit Banaudha","contact-id":58157,"tdoctype":"CR","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":224,"ainumber":"6.4.3.3.4","ainame":"\t            Inter-RAT (clauses 8.4 & 8.4A)","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2015-05-15 18:27:46","uploaded":"2015-05-16 01:41:58","revisionof":"","revisedto":"","release":"Rel-12","crspec":"36.523-1","crspecversion":"12.5.0","workitem":[{"winame":"TEI8_Test"}],"crnumber":3024.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG5_Test_ex-T1\/TSGR5_67_Fukuoka\/Docs\/R5-151689.zip","group":"R5","meeting":"R5-67","year":2015,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]