[{"name":"R5-214796","title":"Correction to applicability for NR MobEnh","source":"Huawei, Hisilicon","contact":"Yuchun Wu","contact-id":77331,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":732,"ainumber":"6.3.13.4","ainame":"TS 38.523-2","tdoc_agenda_sort_order":47960,"status":"revised","reservation_date":"2021-08-05 01:29:07","uploaded":"2021-08-06 08:39:40","revisionof":"","revisedto":"R5-216262","release":"Rel-16","crspec":"38.523-2","crspecversion":"16.8.0","workitem":[{"winame":"NR_Mob_enh-UEConTest"}],"crnumber":167.0,"crrevision":"","crcategory":"F","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG5_Test_ex-T1\/TSGR5_92_Electronic\/Docs\/R5-214796.zip","group":"R5","meeting":"R5-92-e","year":2021,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R5-216262","title":"Correction to applicability for NR MobEnh","source":"Huawei, Hisilicon","contact":"Ingbert Sigovich","contact-id":28887,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":732,"ainumber":"6.3.13.4","ainame":"TS 38.523-2","tdoc_agenda_sort_order":47961,"status":"agreed","reservation_date":"2021-09-01 17:11:01","uploaded":"2021-09-02 00:01:20","revisionof":"R5-214796","revisedto":"","release":"Rel-16","crspec":"38.523-2","crspecversion":"16.8.0","workitem":[{"winame":"NR_Mob_enh-UEConTest"}],"crnumber":167.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"RP-211707","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG5_Test_ex-T1\/TSGR5_92_Electronic\/Docs\/R5-216262.zip","group":"R5","meeting":"R5-92-e","year":2021,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]