[{"name":"R1-1707041","title":"Sidelink link adaptation with feedback information for FeD2D","source":"Huawei, HiSilicon","contact":"Brian Classon","contact-id":45750,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-04-24 19:08:04","uploaded":"2017-05-06 12:47:58","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1707041.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1707210","title":"Discussion on FeD2D Feedback scheme","source":"ZTE","contact":"Carolyn Taylor","contact-id":19440,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-04-28 22:18:52","uploaded":"2017-05-05 20:11:31","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1707210.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1707335","title":"Sidelink Feedback Information and Signalling for Wearable and IoT Use Cases","source":"Intel Corporation","contact":"Seunghee Han","contact-id":47329,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-05-02 03:00:57","uploaded":"2017-05-07 04:41:43","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1707335.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1707586","title":"Discussion on feedback information on sidelink","source":"LG Electronics","contact":"Youngwoo Yun","contact-id":45048,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-05-02 07:18:49","uploaded":"2017-05-06 07:06:02","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1707586.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1707773","title":"sidelink feedback information","source":"Lenovo, Motorola Mobility","contact":"Chenxi Zhu","contact-id":64707,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-05-03 03:29:57","uploaded":"2017-05-06 12:48:00","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1707773.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1708265","title":"Discussion on sidelink adaptation and feedback information","source":"Sony","contact":"Martin Beale","contact-id":82077,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-05-04 16:07:37","uploaded":"2017-05-06 19:02:25","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1708265.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1709424","title":"WF on link adaptation in FeD2D","source":"Huawei, HiSilicon, ITRI","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-05-16 23:28:26","uploaded":"2017-05-17 00:35:16","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1709424.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1709438","title":"WF on SL measurement\/feedback for FeD2D","source":"LG Electronics, Intel, Sony","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2017-05-16 23:28:26","uploaded":"2017-05-17 00:35:16","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1709438.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1709593","title":"WF on Control of Sidelink Transmission Parameters","source":"Intel","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2017-05-18 00:19:59","uploaded":"2017-05-19 04:11:41","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1709593.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1709594","title":"WF on Feedback for Resource Allocation","source":"Intel","contact":"Patrick Merias","contact-id":52292,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":123,"ainumber":"6.2.9.2.3.4","ainame":"Sidelink feedback information","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2017-05-18 00:20:00","uploaded":"2017-05-19 04:11:41","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_89\/Docs\/R1-1709594.zip","group":"R1","meeting":"R1-89","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]