[{"name":"R1-1611099","title":"HARQ-ACK bundling for FeMTC","source":"Ericsson","contact":"Johan Bergman","contact-id":51222,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-10-25 23:02:29","uploaded":"2016-11-05 10:53:39","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611099.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1611263","title":"HARQ-ACK bundling schemes","source":"Sequans Communications","contact":"Ron Toledano","contact-id":49758,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-10-27 13:30:50","uploaded":"2016-11-04 20:28:41","revisionof":"","revisedto":"","release":"Rel-14","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611263.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1611483","title":"HARQ-ACK bundling for FeMTC","source":"Nokia, Alcatel-Lucent Shanghai Bell","contact":"David Bhatoolaul","contact-id":59768,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-01 14:56:28","uploaded":"2016-11-04 15:45:27","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611483.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1611535","title":"Considerations on HARQ-ACK bundling for HD-FDD feMTC","source":"Sony","contact":"Martin Beale","contact-id":82077,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-01 23:45:51","uploaded":"2016-11-04 23:32:14","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611535.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1611622","title":"Support of HARQ-ACK bundling in HD-FDD","source":"Qualcomm Incorporated","contact":"Peter Gaal","contact-id":57198,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-02 02:45:53","uploaded":"2016-11-05 02:33:52","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611622.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1611719","title":"Different Options for HARQ-ACK bundling in CE mode A for HD-FDD","source":"NEC","contact":"Wang Gang","contact-id":43643,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-02 05:24:49","uploaded":"2016-11-04 03:26:34","revisionof":"","revisedto":"","release":"Rel-14","crspec":"","crspecversion":"","workitem":[{"winame":"LTE_MTCe2_L1"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611719.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1611888","title":"HARQ-ACK bundling","source":"Huawei, HiSilicon","contact":"Brian Classon","contact-id":45750,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-02 10:06:27","uploaded":"2016-11-05 03:31:07","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1611888.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1612095","title":"Design of HARQ-ACK bundling for HD-FDD","source":"Lenovo","contact":"Chenxi Zhu","contact-id":64707,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-03 02:58:19","uploaded":"2016-11-04 09:20:19","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1612095.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1612380","title":"HARQ Bundling Considerations","source":"Sierra Wireless, S.A.","contact":"Gustav Vos","contact-id":31476,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-03 21:06:26","uploaded":"2016-11-05 02:21:21","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1612380.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1612595","title":"Detailed design of HARQ-ACK bundling in HD-FDD","source":"ZTE","contact":"Shupeng Li","contact-id":58860,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-04 00:46:23","uploaded":"2016-11-04 21:48:54","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1612595.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1613228","title":"WF on HARQ-ACK bundling","source":"Huawei, HiSilicon","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-27 11:22:17","uploaded":"2016-11-27 11:27:26","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1613228.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1613292","title":"WF on HARQ-ACK bundling in HD-FDD","source":"ZTE, ZTE Microelectronics, Ericsson, Sierra Wireless, Sony, Huawei, HiSilicon","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-11-27 11:22:22","uploaded":"2016-11-27 11:27:26","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1613292.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1613585","title":"WF on HARQ-ACK bundling configuration in HD-FDD","source":"ZTE, ZTE Microelectronics, Huawei, HiSilicon, Ericsson","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-11-27 11:22:54","uploaded":"2016-11-27 11:27:27","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1613585.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1613613","title":"WF on HARQ-ACK bundling scheme for FeMTC","source":"Sequans Communications","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"withdrawn","reservation_date":"2016-11-27 11:22:58","uploaded":null,"revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1613648","title":"WF on repetition for HARQ-ACK bundling","source":"Huawei, HiSilicon, Ericsson, NTT DOCOMO, NEC, ZTE, Intel, Qualcomm","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":81,"ainumber":"6.2.8.1.3","ainame":"HARQ-ACK bundling in HD-FDD","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-11-27 11:23:02","uploaded":"2016-11-27 11:27:27","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_87\/Docs\/R1-1613648.zip","group":"R1","meeting":"R1-87","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]