[{"name":"R1-1719363","title":"DL\/UL common aspects of TDD for NB-IoT","source":"Ericsson","contact":"Johan Bergman","contact-id":51222,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":93630,"status":"available","reservation_date":"2017-11-09 00:35:20","uploaded":"2017-11-17 20:30:01","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1719363.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1719476","title":"Common aspects for TDD NB-IoT","source":"Huawei, HiSilicon","contact":"Matthew Webb","contact-id":45858,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":94760,"status":"available","reservation_date":"2017-11-09 09:05:02","uploaded":"2017-11-17 22:00:12","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1719476.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1719719","title":"Remaining details on common aspects to support TDD NB-IoT","source":"ZTE, SaneChips","contact":"Shupeng Li","contact-id":58860,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":97190,"status":"available","reservation_date":"2017-11-15 01:16:34","uploaded":"2017-11-18 04:38:53","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1719719.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1719741","title":"Common Aspects of NB-IoT TDD Operation","source":"Lenovo, Motorola Mobility","contact":"Chenxi Zhu","contact-id":64707,"tdoctype":"discussion","for":"Discussion","abstract":"","secretary_remarks":"Late contribution","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":97410,"status":"available","reservation_date":"2017-11-15 04:07:56","uploaded":"2017-11-19 12:45:51","revisionof":"R1-1717441","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1719741.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1719885","title":"Discussion on common aspects in TDD NB-IoT","source":"LG Electronics","contact":"Youngwoo Yun","contact-id":45048,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":98850,"status":"available","reservation_date":"2017-11-15 10:33:01","uploaded":"2017-11-18 06:08:14","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1719885.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1720051","title":"Design of common aspects for TDD support in feNB-IoT","source":"Intel Corporation","contact":"Seunghee Han","contact-id":47329,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":510,"status":"available","reservation_date":"2017-11-15 16:30:07","uploaded":"2017-11-18 07:15:12","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1720051.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1720140","title":"Common Aspects of NB-IoT TDD Operation","source":"Nokia, Nokia Shanghai Bell","contact":"Rapeepat Ratasuk","contact-id":70297,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":1400,"status":"available","reservation_date":"2017-11-15 20:19:43","uploaded":"2017-11-17 20:09:47","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1720140.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1720268","title":"Discussion on 2 HARQ processes and cross carrier scheduling","source":"Samsung","contact":"Youngbum Kim","contact-id":39963,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":2680,"status":"available","reservation_date":"2017-11-16 08:28:13","uploaded":"2017-11-18 04:17:18","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1720268.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1720430","title":"General considerations on TDD design","source":"Qualcomm Incorporated","contact":"Alberto Rico Alvarino","contact-id":63913,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":4300,"status":"available","reservation_date":"2017-11-16 09:48:39","uploaded":"2017-11-18 05:03:41","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1720430.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1721146","title":"Summary of NB-IoT Common aspects","source":"Ericsson","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":114600,"status":"noted","reservation_date":"2017-11-30 20:04:07","uploaded":"2017-11-30 20:04:07","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1721146.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1721176","title":"WF on MCL or latency relaxation of NB-IoT","source":"Ericsson","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":117600,"status":"available","reservation_date":"2017-11-30 20:04:07","uploaded":"2017-11-30 20:04:07","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1721176.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1721214","title":"Way Forward on HARQ in TDD NB-IoT","source":"Huawei, HiSilicon","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":121400,"status":"available","reservation_date":"2017-11-29 17:40:40","uploaded":"2017-11-29 17:40:40","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NB_IOTenh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1721214.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1721221","title":"WF on Cross-carrier scheduling in TDD","source":"LG Electronics, Samsung","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":122100,"status":"available","reservation_date":"2017-11-30 11:23:10","uploaded":"2017-11-30 11:23:10","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1721221.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-1721222","title":"WF on Subframe configurations in TDD","source":"LG Electronics","contact":"Patrick Merias","contact-id":52292,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":72,"ainumber":"6.2.6.3.3","ainame":"Common aspects","tdoc_agenda_sort_order":122200,"status":"noted","reservation_date":"2017-11-30 20:04:07","uploaded":"2017-11-30 20:04:07","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_91\/Docs\/R1-1721222.zip","group":"R1","meeting":"R1-91","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]